Thin-Film Electrode Assembly With Anchored Overmolding Adhesion
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Solution Overview
Problem
Conventional electrode assemblies face challenges in achieving flexibility and mechanical rigidity, adhesion issues with thin film substrates like polyimide, and complex manufacturing processes, leading to higher costs and suboptimal therapy delivery.
Innovation Solution
The implementation of anchoring mechanisms, such as T-shaped attachment structures, integrated into the thin film substrate to enhance adhesion with silicone or other molding materials, providing additional mechanical strength and stability while maintaining flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If thin film substrate is used to reduce thickness and improve flexibility, then flexibility and thinness are improved, but mechanical strength and adhesion deteriorate
Solution Approach 1:
The patent uses a composite structure combining a thin polyimide film substrate with an overmolded material (such as silicone rubber or thermoplastic elastomer). The overmolded material provides enhanced mechanical strength and protection while the thin polyimide film maintains flexibility and thinness. This composite approach resolves the contradiction by distributing structural requirements across different materials with complementary properties.
Solution Approach 2:
The patent employs a thin film substrate (polyimide film) as the base structure to achieve flexibility and thinness. The thin film is then reinforced with an overmolded layer that provides mechanical strength without significantly increasing thickness. This approach maintains the essential flexibility of thin films while adding necessary structural support.
2Ease of operation
If thin film substrate is used to improve flexibility, then flexibility is improved, but adhesion to molding materials deteriorates
Solution Approach 1:
The patent incorporates attachment structures (such as protrusions, recesses, or patterned surfaces) on the thin film substrate before the overmolding process. These pre-formed features create mechanical interlocking with the overmolded material, ensuring strong adhesion. By preparing the surface in advance with adhesion-promoting features, the patent overcomes the poor natural adhesion of polyimide film while maintaining flexibility.
Solution Approach 2:
The patent applies different surface properties to different regions of the thin film substrate. Attachment structures are strategically placed in specific locations to maximize adhesion where needed, while other regions maintain the smooth, flexible characteristics of the base material. This localized modification of surface properties resolves the adhesion problem without compromising overall flexibility.
3Strength
If conventional substrate materials are used to provide mechanical strength, then mechanical strength is improved, but flexibility and thinness deteriorate
Solution Approach 1:
The patent replaces conventional rigid substrates with a thin film substrate (polyimide film) that inherently provides flexibility and thinness. Mechanical strength is then achieved not through the substrate material itself, but through the overmolded layer that encapsulates and reinforces the thin film. This inversion of the traditional strength-providing structure enables both flexibility and adequate mechanical strength.
Solution Approach 2:
The patent creates a composite system where the thin polyimide film provides flexibility and the overmolded material provides mechanical strength. Neither material alone would satisfy both requirements, but their combination creates a structure that achieves both flexibility and strength. The composite structure allows each material to perform its optimal function.
4Ease of manufacture
If conventional manufacturing methods are used, then manufacturing simplicity is maintained, but manufacturing precision and therapy optimization deteriorate
Solution Approach 1:
The patent modifies manufacturing parameters and processes to achieve precise stimulation contact geometry. This includes controlling the thickness of the thin film substrate, the composition and curing conditions of the overmolded material, and the formation of attachment structures. By carefully adjusting these parameters, the patent achieves high manufacturing precision for optimized therapy delivery while maintaining relative manufacturing simplicity through established techniques.
Data Source
AI summary
An apparatus includes an elongate thin film body extending from a first end to a second end. A plurality of electrodes is disposed on the thin film body. A plurality of electrode connection traces each coupled to a respective one of the electrodes. A plurality of attachment structures is placed at predetermined locations about the thin film body. An outer molding surrounds the thin film body. The attachment structures provide connection points for the outer molding, thus allowing for adhesion between the outer molding and the thin film body.