Thin Film Electrode Anchoring for Delamination Resistance
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Solution Overview
Problem
Existing electrode assemblies for medical applications face challenges in achieving the necessary mechanical robustness and flexibility, particularly in thin film substrates, which are fragile and prone to delamination when bonded with molding materials.
Innovation Solution
The implementation of anchoring mechanisms, such as attachment structures with T-bar-like shapes, integrated into the thin film substrate to enhance adhesion with molding materials like silicone, and the use of connection traces and wires to establish electrical connections with multi-lumen leads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If thin film substrates are used for electrode assemblies, then flexibility and thinness are improved, but mechanical robustness and resistance to delamination deteriorate
Solution Approach 1:
The patent uses a composite structure combining a thin film substrate (providing flexibility and thinness) with a molding material (providing mechanical robustness). The molding material is configured to surround and support the thin film substrate, creating a composite electrode assembly that achieves both thinness and mechanical strength.
Solution Approach 2:
The patent employs a thin film substrate as the core structure to achieve the desired thinness and flexibility, while the molding material acts as a protective shell that provides mechanical support. This combination allows the electrode assembly to be both thin and mechanically robust.
2Length of moving object
If thin film substrates are used for electrode assemblies, then flexibility and thinness are improved, but adhesion to molding materials deteriorates
Solution Approach 1:
The patent applies a preliminary action by configuring the molding material to extend along and surround the thin film substrate before final assembly. This preliminary configuration ensures proper adhesion and prevents delamination by establishing strong bonding interfaces in advance.
Solution Approach 2:
The patent creates a composite structure where the molding material is chemically or physically bonded to the thin film substrate. This composite approach ensures reliable adhesion between the two materials, preventing delamination while maintaining the thinness and flexibility of the original substrate.
3Strength
If conventional substrate materials are used for electrode leads, then mechanical strength and rigidity are improved, but flexibility and thinness deteriorate
Solution Approach 1:
The patent replaces conventional rigid substrates with a thin film substrate that provides the necessary mechanical strength while maintaining flexibility and thinness. The molding material serves as an additional support structure that enhances mechanical strength without compromising the thin profile.
Solution Approach 2:
The patent uses a composite material system combining a thin film substrate with a molding material. This composite structure achieves the mechanical strength of conventional substrates while maintaining the flexibility and thinness of modern thin film technology.
4Strength
If backing material is added to support electrodes, then mechanical robustness is improved, but flexibility and thinness deteriorate
Solution Approach 1:
The patent uses a thin film substrate as the base structure and adds a molding material layer that provides mechanical robustness without significant thickness increase. The molding material is configured to surround and support the thin film substrate, providing strength while maintaining flexibility.
Solution Approach 2:
The patent creates a composite structure combining a thin film substrate with a molding material that provides mechanical support. This composite approach achieves the necessary mechanical robustness while maintaining the thinness and flexibility required for implantable electrode assemblies.
Data Source
AI summary
A lead assembly includes a thin film body supporting a plurality of electrodes configured to provide electrical stimulation or sensing. The thin film body includes a substrate. A plurality of electrode connection traces is situated on the thin film body and electrically connected to respective ones of the plurality of electrodes. A connection wire is configured to provide stimulation or sensing signals for transmission to the plurality of electrodes. The connection wire extends from a lead and is substantially larger than each of the electrode connection traces. A coupling structure is configured to provide electrical connection between the connection wire and the electrode connection traces.