Thin-Film Electrode Assembly With Silicone-Locking Tabs
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Solution Overview
Problem
Existing electrode assemblies for medical applications are challenging to manufacture due to their small, fragile, and easily damaged components, and they often require thick backing materials for support, which limits flexibility and comfort during implantation.
Innovation Solution
The development of a thin film electrode assembly that incorporates a polyimide thin film substrate with integrated attachment structures, such as T-shaped tabs, to enhance adhesion with a silicone molding material, providing mechanical strength and stability while maintaining flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional thick backing material is used to support electrodes, then mechanical strength and structural stability are improved, but flexibility and comfort during implantation deteriorate
Solution Approach 1:
The patent employs a thin film substrate (thickness 0.001-0.010 inches) instead of conventional thick backing material, allowing the electrode assembly to be flexible and conformable while maintaining structural integrity through integrated attachment structures
Solution Approach 2:
The patent creates a composite structure combining thin film substrate with silicone molding material and attachment structures, achieving both flexibility from the thin film and mechanical strength from the composite assembly
2Adaptability or versatility
If thin film substrate is used to improve flexibility, then adaptability and comfort are improved, but mechanical strength and structural stability deteriorate
Solution Approach 1:
The patent divides the thin film substrate into multiple segments including attachment structures (tabs) that can be independently formed and folded, providing localized reinforcement without compromising overall flexibility
Solution Approach 2:
The patent adds a third dimension by folding attachment structures perpendicular to the substrate plane, creating a multi-dimensional structure that provides mechanical strength through vertical reinforcement while maintaining the thin profile for flexibility
3Length of stationary object
If thin film substrate is used to reduce thickness, then comfort and conformance are improved, but ease of manufacture and handling deteriorate
Solution Approach 1:
The patent performs preliminary actions by pre-forming attachment structures on the thin film substrate before final assembly, making the thin film easier to handle and manufacture by providing built-in reinforcement features
Solution Approach 2:
The attachment structures serve as intermediaries between the fragile thin film substrate and the manufacturing process, providing grip points and structural support that facilitate handling during manufacture and assembly
4Reliability
If attachment structures are added to enhance adhesion, then reliability and bonding strength are improved, but device complexity increases
Solution Approach 1:
The patent merges the attachment structures with the thin film substrate itself, forming them as an integrated part of the substrate rather than separate components, thereby enhancing adhesion without significantly increasing device complexity
Solution Approach 2:
The attachment structures serve multiple functions: providing adhesion to silicone molding material, reinforcing the thin film substrate, and facilitating handling during manufacture, thereby improving reliability without adding unnecessary complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thin film electrode assembly achieves improved adhesion between the polyimide substrate and the silicone material, reducing the likelihood of delamination and enhancing the assembly's mechanical strength, flexibility, and effectiveness in delivering electrical stimulation therapy.
Implementation Method 1
a silicone molding material is disposed over the back side of the thin film substrate. The attachment structures promote adhesion between the silicone material and the thin film substrate
Data Source
AI summary
An apparatus includes an elongate thin film body extending from a first end to a second end. A plurality of electrodes is disposed on the thin film body. A plurality of electrode connection traces each coupled to a respective one of the electrodes. A plurality of attachment structures is placed at predetermined locations about the thin film body. An outer molding surrounds the thin film body. The attachment structures provide connection points for the outer molding, thus allowing for adhesion between the outer molding and the thin film body.