Thin Film Fabricating Apparatus Electrostatic Deposition

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Solution Overview

Problem

Conventional methods for fabricating organic electroluminescent devices face challenges in achieving mass production of uniform nano-scale thin film layers due to high manufacturing costs, equipment complexity, and limitations in maintaining the light-emitting function, particularly with the electro-spray method which is not practical for large-scale production and is prone to electrolytic corrosion and pollution.

Innovation Solution

A thin film fabricating apparatus is designed with needle electrodes and ring electrodes, where specific voltage configurations and a supplying and collecting unit maintain a consistent thin film-forming material level, allowing for stable deposition of nano-scale layers on a substrate, using a sloped electrode bath and a substrate stand with a reversing unit for efficient material distribution and recycling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the electro-spray method is used to fabricate organic light emitting devices, then a pattern can be provided in a simple way, but the treatment time is substantially long and the method is not suitable for mass production

Engineering Contradiction:
Improvepattern fabrication simplicityVSAvoidmass production capability
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent replaces the conventional electro-spray method with a new apparatus that uses a combination of electrostatic field generation and mechanical material supply. The material supply unit delivers thin film-forming material to the electrode bath where it is deposited on the substrate under electrostatic attraction, combining mechanical material delivery with electrostatic deposition to achieve both simplicity and mass production capability

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts the material supply function from the electro-spray process itself and separates it into a dedicated material supply unit. This unit supplies material to the electrode bath independently, allowing the electrostatic deposition process to focus on pattern formation while the supply unit handles material delivery, thereby reducing treatment time and enabling mass production

Inventive Principle:
Principle #2Taking out (Extraction)

2Manufacturing precision

If the conventional electro-spray method is used, then nano-scale thin film layers can be deposited, but electrolytic corrosion of parts and pollution occur

Engineering Contradiction:
Improvenano-scale layer depositionVSAvoidelectrolytic corrosion and pollution
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful electrolytic corrosion effect into a beneficial electrostatic deposition process. By using an electrode bath with controlled electrostatic fields and a material supply unit that delivers material in a controlled manner, the process achieves nano-scale precision without the corrosive side effects of conventional electro-spray methods

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent introduces an electrode bath as an intermediary between the material supply unit and the substrate. This intermediary component enables controlled material deposition with nano-scale precision while preventing direct contact between the spray mechanism and substrate that causes electrolytic corrosion and pollution

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If the wet process is used to fabricate organic thin film, then mass production with reduced cost is achieved, but the solvent melts and smears the lower layer causing delamination

Engineering Contradiction:
Improvemass production capabilityVSAvoidlayer adhesion
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent changes the fundamental parameter of the deposition process from liquid solvent-based (wet process) to electrostatic field-based deposition. By using an electrode bath where material is deposited under electrostatic attraction rather than solvent application, the process achieves mass production capability while preventing solvent-induced delamination of lower layers

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the wet process mechanism with an electrostatic deposition mechanism. Instead of using solvents to apply material, the system uses electrostatic fields in the electrode bath to attract and deposit material from the material supply unit, thereby maintaining layer adhesion while enabling mass production

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus enables stable and uniform deposition of nano-scale thin film layers, enhancing the efficiency and cost-effectiveness of mass production while preventing material delamination and maintaining the light-emitting function, thus overcoming the limitations of existing methods.

Implementation Method 1

a strong electric field is generated between needle electrodes and ring electrodes, fine liquid droplets are emitted

Methodology Applied
Scientific EffectElectrostatic spray: Electrostatic Discharge

Implementation Method 2

the fine liquid droplets are collected by ring electrodes and a substrate

Methodology Applied
Scientific EffectElectrostatic attraction: Electrostatic Induction

Implementation Method 3

the solvent is evaporated by rapidly increasing the surface area to attach only a solute (e.g., organic material) in the solution as a dried state onto the substrate

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 4

to provide a uniform layer, to stack a plurality of layers

Methodology Applied
Scientific EffectDeposition: Deposition (physical)

Data Source

PatentEP3007245B1Thin film fabricating apparatus
Publication Date: 2020.04.22 SAMSUNG ELECTRONICS CO LTD
  • EP3007245B1 patent drawingFigure 1
  • EP3007245B1 patent drawingFigure 2
  • EP3007245B1 patent drawingFigure 3

AI summary

A thin film fabricating apparatus includes: an electrode bath (6) which contains a thin film-forming material (5); a plurality of needle electrodes (4) disposed in the electrode bath (6); a plurality of ring electrodes (3) disposed on the electrode bath (6) at positions corresponding to the needle electrodes (4); and a substrate stand (1) disposed opposite to the needle electrodes (4) and the ring electrodes (3), where the substrate stand holds the substrate (2), on which a thin film is to be formed.