Thin Film Encapsulation Layer for Display Devices
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Solution Overview
Problem
Conventional thin film encapsulation layers in display devices face challenges in reliability, particularly in preventing moisture and oxygen penetration, which affects the durability and flexibility of the devices, especially under high temperature and humidity conditions.
Innovation Solution
A method of forming a thin film encapsulation layer using chemical vapor deposition, involving alternating layers of inorganic and organic materials, with specific plasma treatments to reduce dangling bonds and minimize thickness, ensuring the layer remains non-oxidized and maintains flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the thin film encapsulation layer is made thinner to improve flexibility, then flexibility is improved, but moisture and oxygen penetration increases reducing reliability
Solution Approach 1:
The encapsulation layer uses a composite structure with alternating inorganic layers (silicon nitride, silicon oxide) and organic layers (polyimide), where each material type contributes different properties: inorganic layers provide moisture and oxygen barrier functions while organic layers provide flexibility and stress relief, achieving both thinness and reliability
Solution Approach 2:
The encapsulation layer is divided into multiple thin sub-layers (first inorganic layer, first organic layer, second inorganic layer) rather than using a single thick layer, allowing each sub-layer to be optimized for its specific function while maintaining overall thinness and flexibility
2Reliability
If plasma treatment is applied to reduce dangling bonds and improve barrier properties, then reliability is improved, but oxidation may occur worsening the harmful factors
Solution Approach 1:
The plasma treatment is performed in a nitrogen atmosphere instead of oxygen or air, allowing the plasma to reduce dangling bonds and improve barrier properties without introducing oxidation, as nitrogen serves as an inert environment that prevents oxygen exposure during the treatment process
Solution Approach 2:
The plasma treatment parameters (power, pressure, temperature, spacing) are maintained at specific values during the nitrogen plasma process to achieve effective dangling bonds reduction while preventing oxidation, optimizing the treatment conditions to avoid harmful side effects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the barrier properties of the encapsulation layer, reducing thickness while maintaining reliability and flexibility, allowing the display device to withstand high temperature and humidity without oxidation, thus improving its overall performance and durability.
Implementation Method 1
forming a thin film encapsulation layer on the light emitting structure by chemical vapor deposition equipment
Implementation Method 2
performing a first plasma treatment on a first portion of the first inorganic layer which is opposite to a second portion of the first inorganic layer facing the light emitting structure
Data Source
AI summary
A method of manufacturing a display device includes forming a light emitting structure on a substrate and forming a thin film encapsulation layer on the light emitting structure by chemical vapor deposition equipment. The forming the thin film encapsulation layer includes forming a first inorganic layer and performing a first plasma treatment on a first portion of the first inorganic layer which is opposite to a second portion of the first inorganic layer facing the light emitting structure. A first raw material in the forming the first inorganic layer includes hydrogen. A second raw material in the performing the first plasma treatment exclusively consists of hydrogen.