Thin-Film Electrode Housing Interface for Miniaturized Connections
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Solution Overview
Problem
Existing lead wire bonding methods for thin film composite electrodes in implantable medical devices require multiple spot weldings, leading to increased thickness, poor reproducibility, and difficulty in miniaturization and integration due to the thin and fragile nature of the lead wires.
Innovation Solution
A connected structure of a thin film electrode and housing, utilizing a porous thin film with spaced electrical connection units and installation grooves in the housing, allowing direct connection to external circuits through slots and pads, and using biocompatible materials to ensure mechanical stability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead wire bonding method is used to connect thin film composite electrode with external structure, then electrical connection is achieved, but the thickness at bonding position increases and mechanical stability deteriorates due to thin and fragile lead wires
Solution Approach 1:
The patent extracts the lead wire bonding process entirely by providing direct electrical connection units integrated into the thin film composite electrode structure. The connection units with conductive materials are built directly on the electrode, eliminating the need for separate lead wires and their associated bonding complexity, thus maintaining thin profile while improving mechanical stability.
Solution Approach 2:
The patent merges the electrical connection function directly into the thin film composite electrode structure by integrating connection units with conductive materials at specific positions. This combination eliminates the need for separate lead wire components and achieves both thin profile and reliable electrical connection simultaneously.
2Reliability
If spiral wire structure and multiple spot weldings are added to increase reliability, then mechanical stability improves, but overall thickness increases and miniaturization becomes difficult
Solution Approach 1:
The patent removes the spiral wire structure and multiple spot welding processes by providing integrated connection units with conductive materials that achieve reliable electrical connection in a single fabrication step, eliminating the need for additional thickening components and complex assembly processes.
Solution Approach 2:
The patent changes the fabrication approach from post-assembly wire bonding to integrated circuit-level connection formation during thin film deposition. This parameter change enables reliable electrical connection to be achieved at the thin film stage itself, preventing thickness increase that would occur with added wire structures.
3Reliability
If thickness at lead wire bonding position is increased to improve connection stability, then mechanical reliability improves, but minimum distance between electrodes increases and integration density decreases
Solution Approach 1:
The patent merges the electrical connection function directly into the thin film composite electrode structure at the same thickness level, eliminating the need for separate bonding components that would increase local thickness and require additional spacing between adjacent electrodes.
Solution Approach 2:
The patent changes the connection formation parameter from post-fabrication wire bonding (requiring thickness increase) to integrated connection unit formation during thin film deposition (maintaining original thickness), thereby enabling closer electrode spacing and higher integration density.
Data Source
AI summary
A connection structure of a thin film electrode and a housing includes at least one thin film electrode unit and a housing; the electrode unit includes a porous thin film, a first electrode and a second electrode attached to two sides of the film; a part of the film and a part of the first electrode form a first electrical connection unit; a part of the film and a part of the second electrode form a second electrical connection unit; at least one installation groove is provided on the inner wall surface of the housing; the electrode unit is provided in the installation groove; at least one communication unit communicated with the installation groove is further provided on the outer wall surface of the housing; the first electrical connection unit and the second electrical connection unit are respectively communicated with an external circuit of the housing through the communication unit.