Thin Film Substrate LED Package for Heat Dissipation
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Solution Overview
Problem
Conventional LED packages are limited by thickness due to the use of a printed circuit board substrate, which hinders miniaturization and lacks effective heat dissipation, especially for high-power applications, and existing thin package solutions are costly and complex to manufacture.
Innovation Solution
A thin package structure for compound semiconductor devices using a thin film substrate with conductive films and insulating dielectric material, eliminating the need for a printed circuit board, and employing wire-bonding or flip-chip bonding with a transparent encapsulation for improved heat dissipation and reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a printed circuit board substrate with insulation layer is used, then electrical connectivity and insulation are provided, but the package thickness cannot be reduced further
Solution Approach 1:
The patent extracts and removes the traditional printed circuit board substrate and its insulation layer from the LED package structure. Instead, it uses a thin film substrate with conductive patterns formed directly on it, eliminating the need for a thick PCB substrate and achieving reduced package thickness while maintaining electrical connectivity functions
Solution Approach 2:
The patent employs a thin film substrate with conductive patterns formed directly on it, replacing the traditional thick PCB substrate. This thin film approach enables the package thickness to be reduced to below 200 micrometers while still providing the necessary electrical connectivity and structural support functions
2Temperature
If epoxy resin insulation layer is used, then electrical insulation is provided, but heat dissipation is poor for high power applications
Solution Approach 1:
The patent uses a thin film substrate made of metal or ceramic materials with excellent thermal conductivity properties. This composite material approach replaces the traditional epoxy resin insulation layer, providing both electrical insulation and superior heat dissipation capabilities for high-power LED applications
Solution Approach 2:
The patent introduces a thermal interface material or thermal vias as intermediaries between the LED chip and the thin film substrate. These intermediaries facilitate efficient heat transfer from the chip to the substrate, solving the heat dissipation problem while maintaining the simplicity of the manufacturing process
3Length of stationary object
If temporary substrate with laser removal is used, then package thickness is reduced, but manufacturing complexity and cost increase
Solution Approach 1:
The patent performs preliminary actions by forming the conductive patterns directly on the thin film substrate before mounting the LED chip. This eliminates the need for subsequent laser removal of temporary substrates, simplifying the manufacturing process while achieving the same thin package thickness result
Solution Approach 2:
The patent uses a permanent thin film substrate that serves its full function throughout the product lifecycle, replacing the disposable temporary substrate approach. This eliminates costly laser removal processes and complex manufacturing steps while maintaining the thin package profile
Data Source
AI summary
A package structure of a compound semiconductor device comprises a thin film substrate, a die, at least one metal wire and a transparent encapsulation material. The thin film substrate comprises a first conductive film, a second conductive film, and an insulating dielectric material. The die is mounted on the surface of the first conductive film, and is electrically connected to the first conductive film and the second conductive film through the metal wire. The transparent encapsulation material overlays the first conductive film, second conductive film, and die. The surfaces of the first conductive film and second conductive film which is opposite the transparent encapsulation material act as electrodes. The insulating dielectric material is between the first conductive film and second conductive film.