Thin-Film NTC Sensor Layout for Tight Resistance Tolerance
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Solution Overview
Problem
Existing technologies face challenges in manufacturing thin-film NTC temperature sensors with tight resistance tolerances required for accurate temperature measurement in miniaturized MEMS and SESUB structures, as conventional assembly technologies cannot be used and resistance dispersion exceeds required tolerances due to manufacturing process limitations.
Innovation Solution
A sensor element with a thin-film NTC temperature sensor design featuring a functional layer and electrodes structured to achieve narrow resistance tolerance, utilizing laser trimming to adjust resistance values, and a compact form factor suitable for integration into MEMS or SESUB structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If structures are miniaturized for modern packaging designs, then integration capability into MEMS or SESUB structures is improved, but resistance dispersion increases beyond required tolerances
Solution Approach 1:
The patent applies preliminary action by forming compensation structures (additional functional layer portions or electrode extensions) during the manufacturing process before final assembly. These structures are pre-configured to compensate for resistance deviations, allowing the sensor to achieve target resistance values despite miniaturization effects and manufacturing variations.
Solution Approach 2:
The patent changes physical parameters by modifying the geometry of functional layers or electrodes (area, length, width) to adjust resistance values. By varying these dimensional parameters, the sensor can compensate for resistance dispersion caused by miniaturization and process variations, achieving tight resistance tolerances in small-form-factor sensors.
2Ease of manufacture
If conventional assembly technologies are used for NTC chips, then manufacturing experience and existing processes are utilized, but integration into MEMS or SESUB structures is not possible
Solution Approach 1:
The patent achieves universality by designing a sensor element structure that can be integrated into multiple platforms (MEMS, SESUB, or conventional PCB mounting). The thin-film construction on a carrier substrate allows the same basic structure to serve different integration purposes, making the manufacturing process versatile across different application domains.
Solution Approach 2:
The patent replaces conventional mechanical assembly methods (soldering SMD components, wire bonding) with thin-film deposition and lamination techniques. This substitution enables direct integration into MEMS or SESUB structures while maintaining manufacturing feasibility through established thin-film processing methods.
3Volume of moving object
If thin-film NTC temperature sensors are manufactured, then miniaturization for MEMS or SESUB integration is achieved, but resistance tolerance is wider compared to classic designs
Solution Approach 1:
The patent implements feedback by measuring the actual resistance of the functional layer after deposition and using this information to determine compensation requirements. Based on the measured resistance value, the compensation structure is configured to adjust the overall sensor resistance to the target value, thereby compensating for deviations caused by thin-film manufacturing variations.
Solution Approach 2:
The patent applies segmentation by dividing the functional layer or electrode into multiple portions (active sensing area and compensation area). The compensation portion is separately configured and adjusted to counterbalance resistance deviations in the active area, enabling precise resistance control in miniaturized thin-film sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sensor element achieves high accuracy in temperature measurement with resistance tolerances comparable to classic designs, allowing precise temperature sensing in miniaturized systems.
Implementation Method 1
The functional layer has a material with a temperature-dependent electrical resistance... Preferably, the functional layer has an NTC ceramic
Implementation Method 2
The top side is electrically insulating... an insulating layer, for example Al2O3, AlN, SiO2 or Si3N4 or combinations of layers of these materials, is formed on the top side of the carrier
Data Source
AI summary
A sensor element for measuring a temperature has a carrier and at least one functional layer which has a material with a temperature-dependent electrical resistance. The functional layer is arranged on the carrier. The sensor element has at least two electrodes with electrode fingers and at least two contact pads for electrically contacting the sensor element. One contact pad is arranged directly on a partial area of one of the electrodes in each case. The sensor element is designed to be integrated into an electronic system as a discrete component. The sensor element has a narrow resistance tolerance. The functional layer and/or at least one of the at least two electrodes are structured to adjust the resistance value.