Thin-Film Packaging Structure for Bendable OLED Barrier Stability

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Solution Overview

Problem

Traditional thin film packaging structures for flexible OLED display panels face challenges in maintaining bendability due to stress issues in inorganic layers, which can lead to layer breakage or separation.

Innovation Solution

A thin film packaging structure is designed with a first inorganic packaging layer, an organic packaging layer, a second inorganic packaging layer, and at least one first inorganic adjusting layer. The adjusting layers have a higher oxygen content and greater elasticity modulus than the packaging layers, strategically positioned to offset stress neutral layers and enhance structural stability during bending.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional thin film packaging structure with inorganic and organic layers is used, then water and oxygen protection is achieved, but the inorganic layer experiences greater stress when bent, leading to layer breakage or separation

Engineering Contradiction:
Improveprotection against water and oxygenVSAvoidbending strength of inorganic layer
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent changes the physical-chemical parameters of the inorganic adjusting layer by controlling oxygen content during deposition. The oxygen content is set to be higher than in traditional inorganic packaging layers, which fundamentally alters the material properties and reduces brittleness, allowing the layer to withstand bending stresses without breaking or separating.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite thin film packaging structure by integrating an inorganic adjusting layer with specific oxygen content between the inorganic packaging layer and the organic packaging layer. This composite structure combines the protective function of traditional inorganic layers with the improved flexibility of oxygen-rich inorganic material, achieving both protection and bendability.

Inventive Principle:
Principle #40Composite materials

2Reliability

If traditional thin film packaging structure is used, then packaging function is achieved, but film layers are easily separated, reducing bendability of display panel

Engineering Contradiction:
Improvepackaging functionVSAvoidbendability of display panel
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent modifies the interfacial properties between film layers by introducing an inorganic adjusting layer with controlled oxygen content. This parameter change enhances the adhesion between the inorganic packaging layer and organic packaging layer, preventing separation during bending operations and improving the overall bendability of the display panel.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The inorganic adjusting layer acts as an intermediary layer between the inorganic packaging layer and the organic packaging layer. This intermediate layer with specific oxygen content improves interfacial bonding and stress distribution, preventing delamination and enhancing the bendability of the entire packaging structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If inorganic layer thickness is increased to improve protection, then water and oxygen barrier is enhanced, but stress during bending increases, causing breakage

Engineering Contradiction:
Improvewater and oxygen barrierVSAvoidstress in inorganic layer during bending
Core Design Contradiction:
ReliabilityVSStress or pressure

Solution Approach 1:

The patent changes the compositional parameter of the inorganic layer by increasing oxygen content during deposition. This parameter change reduces the inherent stress and brittleness of the inorganic material, allowing thicker layers to be deposited that provide enhanced water and oxygen barriers without experiencing excessive stress or breaking during bending.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250024702A1Thin film packaging structure and display panel
Publication Date: 2025.01.16 CHENGDU BOE OPTOELECTRONICS TECH CO LTD
  • US20250024702A1 patent drawing
  • US20250024702A1 patent drawing
  • US20250024702A1 patent drawing

AI summary

A thin film packaging structure includes a first inorganic packaging layer, an organic packaging layer provided at a side of the first inorganic packaging layer, a second inorganic packaging layer provided at a side of the organic packaging layer facing away from the first inorganic packaging layer, and at least one first inorganic adjusting layer. An oxygen content of the at least one first inorganic adjusting layer is greater than an oxygen content of the first inorganic packaging layer and/or the second inorganic packaging layer; the at least one first inorganic adjusting layer includes two first inorganic adjusting layers; one of the two first inorganic adjusting layers is provided between the organic packaging layer and the second inorganic packaging layer; and another one of the two first inorganic adjusting layers is provided on a side of the second inorganic packaging layer facing away from the organic packaging layer.