Thin-Film Oscillator Packaging Without a Ceramic Base Cavity

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Solution Overview

Problem

Existing oscillator packaging methods face challenges in miniaturization due to the use of ceramic bases and cavities, limiting the reduction of size and posing difficulties in achieving compact designs.

Innovation Solution

An oscillator structure that eliminates the need for a carrying base body and its cavity by using an insulating layer to seal and protect the resonator and oscillation chip, with a first electrode structure on the insulating layer for electrical connection, allowing for minimized packaging and improved reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a ceramic base and cavity are used for packaging the resonator and oscillation chip, then the oscillator achieves reliable packaging and electrical connection, but the size of the oscillator increases and miniaturization is limited

Engineering Contradiction:

Improvepackaging reliabilityVSAvoidoscillator size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent extracts and eliminates the ceramic base and cavity from the oscillator packaging structure. Instead of using a traditional ceramic base with a cavity to hold the resonator and oscillation chip, the invention directly packages these components on a substrate without requiring a separate carrying base body, thereby removing unnecessary structural elements that increase size while maintaining packaging reliability

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs an insulating layer as a thin film structure to replace the bulky ceramic base and cavity assembly. This insulating layer serves multiple functions including electrical insulation, mechanical support, and sealing, achieving reliable packaging in a much thinner and smaller profile compared to traditional ceramic-based structures

Inventive Principle:

Principle #30Flexible shells and thin films

2Ease of manufacture

If the oscillation chip is exposed to the outside for electrical connection, then electrical connection is simplified, but the oscillation chip is vulnerable to external stress and environmental damage

Engineering Contradiction:

Improveelectrical connection simplicityVSAvoidchip protection

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent implements a nested structure where the oscillation chip is housed within a resonator cavity, which is in turn packaged within the insulating layer structure. This nested arrangement protects the oscillation chip from external stress and environmental damage while maintaining electrical connection capability through the layered structure

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The insulating layer acts as an intermediary structure that provides both mechanical protection and electrical connection pathways. It mediates between the need to protect the oscillation chip and the need to establish electrical connections, offering stress buffering while enabling controlled signal transmission through via holes and conductive structures

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If a carrying base body is used to mount the resonator and oscillation chip, then stable mounting is achieved, but the overall packaging size increases

Engineering Contradiction:

Improvemounting stabilityVSAvoidpackaging volume

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

The patent merges the functions of the carrying base body, insulating layer, and packaging structure into a single integrated substrate structure. The substrate serves as both the mounting platform for the resonator and oscillation chip and as part of the packaging structure itself, eliminating the need for a separate carrying base body and thereby reducing overall packaging volume while maintaining mounting stability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate is designed to perform multiple functions simultaneously: providing mechanical support for mounting components, offering electrical insulation, enabling electrical connections through via holes, and contributing to the overall packaging structure. This multi-functional design eliminates the need for separate dedicated carrying base bodies, achieving space-efficient packaging

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20260005649A1Oscillator and manufacturing method thereof, and electronic device

Publication Date: 2026.01.01 ULTRA SHINING TECHNOLOGY LTD

AI summary

An oscillator and a manufacturing method thereof are provided. The oscillator includes a resonator, an oscillation chip, an insulating layer and a first electrode structure. The resonator includes a vibrating element and an airtight packaging structure packaged around the vibrating element. The oscillation chip is arranged on one side of the airtight packaging structure. The insulating layer covers at least one side of the oscillation chip and at least one side of the airtight packaging structure. The insulating layer has a first via hole, and a conductive material is provided in the first via hole. The first electrode structure is arranged on the insulating layer and electrically connected to the oscillation chip through the conductive material inside the first via hole.