Thin Film Pad LED Package for Soldering Reliability
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Solution Overview
Problem
Existing light emitting element packages face challenges in miniaturization due to limited pad area and shape, leading to soldering failures and inadequate heat dissipation, particularly in small packages like chip scale packages.
Innovation Solution
A light emitting element package with a thin film pad that includes a plurality of light emitting diodes mounted on a common and individual thin film pads, with a larger soldering region for secure soldering and improved heat dissipation, using a conductive adhesive and a reflective layer, and manufactured by forming thin film pads on a substrate and separating them for packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the light emitting diode is directly molded on a molding layer without using a substrate to implement a small package, then the package size is reduced, but the electrode pad area becomes narrow and the pad shape is limited, causing soldering failures
Solution Approach 1:
The patent divides the package structure into separate functional components: the light emitting diode chip, the molding layer, and the substrate with electrode pads. This segmentation allows the pad area to be independently enlarged on the substrate without increasing the overall package volume, resolving the contradiction between miniaturization and soldering reliability
Solution Approach 2:
The patent extends the pad structure from the traditional planar configuration to a three-dimensional configuration by forming pads that protrude from the molding layer surface. This dimensional change increases the effective pad area and improves soldering reliability without increasing the package footprint
2Volume of moving object
If the light emitting diode is directly molded on a molding layer without a substrate, then the package size is reduced, but the heat dissipation capability becomes insufficient
Solution Approach 1:
The patent introduces a substrate as an intermediary component between the light emitting diode and the heat sink. The substrate serves as a thermal conduction path, efficiently transferring heat from the LED chip through the molding layer to the heat sink, thereby maintaining effective heat dissipation in a miniaturized package structure
Solution Approach 2:
The patent utilizes materials with appropriate thermal expansion coefficients in the package structure to facilitate thermal management. The substrate and molding layer are selected to have compatible thermal properties that enable efficient heat transfer while maintaining structural integrity under thermal stress
3Reliability
If the electrode pad area is increased to prevent soldering failures, then the soldering reliability is improved, but the package size increases
Solution Approach 1:
The patent employs a thin film molding layer that can be formed with complex three-dimensional structures. This thin film structure allows the creation of protruding pads with large surface area while maintaining a compact overall package volume, as the padding structure utilizes the vertical dimension rather than expanding the horizontal footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses soldering failures and enhances heat dissipation characteristics by providing a sufficient pad area and shape for secure soldering and efficient heat management in small light emitting element packages.
Implementation Method 1
a conductive adhesive... for soldering the light emitting element package
Implementation Method 2
improve a heat dissipation characteristic problem... efficient heat management
Data Source
AI summary
The present invention relates to a light emitting element package with a thin film pad and a manufacturing method thereof, and more particularly, to a light emitting element package with a thin film pad, which mounts and molds a light emitting diode on a thin film pad formed on a substrate and then, separates the light emitting diode from the substrate and configures a light emitting element package to effectively suppress occurrence of defective soldering or the like by securing a sufficient pad area and shape required for soldering by using the thin film pad while implementing a small light emitting element package such as a chip scale package or the like and a manufacturing method thereof.Disclosed is a light emitting element package including: a plurality of light emitting diodes having a first electrode pad and a second electrode pad at a lower portion thereof; a thin film pad having the plurality of light emitting diodes mounted thereon and constituted by one common thin film pad and a plurality of individual thin film pads; and a molding layer molding the plurality of light emitting diodes and the thin film pad, in which a lower surface of the thin film pad has a light emitting element package soldering region for soldering the light emitting element package, and an area of the light emitting element package soldering region is larger than that of each of the first electrode pad and the second electrode pad of the light emitting diode.