Thin-Film Component Pick-and-Place for Smaller PCB Assemblies
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Solution Overview
Problem
Surface mounted components consume large areas of circuit boards, increasing the size, weight, and cost of electronic devices, and the surface mounting process is time-consuming, slowing down fabrication and packaging operations.
Innovation Solution
Prefabricate thin film components on a wafer substrate in large numbers, cut and place them onto a microelectronic device, using a method that includes forming layers such as a release layer, solder layers, and component function layers, allowing for faster and more precise assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If surface mounted components are used, then electronic devices can be assembled with conventional processes, but the components consume large areas of circuit boards increasing size, weight, and cost
Solution Approach 1:
The patent applies thin film technology to create ultra-small passive electronic components (resistors, capacitors, inductors) with dimensions measured in micrometers. These thin film components are deposited onto substrates using vapor deposition or sputtering processes, creating components that are thousands of times smaller than conventional surface mounted components, thereby dramatically reducing circuit board area consumption while maintaining manufacturability through standardized fabrication processes
Solution Approach 2:
The patent segments the circuit board assembly process by separating component fabrication from board assembly. Thin film components are fabricated independently on separate substrates using semiconductor-style batch processing, then picked and placed onto the circuit board. This segmentation enables ultra-small component sizes while maintaining conventional assembly compatibility through standardized pick-and-place interfaces
2Ease of manufacture
If surface mounting process is used, then conventional assembly methods can be employed, but the process is time consuming which slows down fabrication and packaging operations
Solution Approach 1:
The patent applies preliminary action by pre-fabricating thin film components on substrates using batch semiconductor-style processes before board assembly. Multiple components are manufactured simultaneously in parallel on the same substrate, and pre-tested for electrical characteristics. This preliminary batch fabrication dramatically increases productivity compared to conventional single-component-at-a-time surface mounting, while the final pick-and-place step maintains compatibility with existing assembly infrastructure
Solution Approach 2:
The patent merges multiple discrete component fabrication steps into a single batch process. Multiple different passive components (resistors, capacitors, inductors) are fabricated simultaneously on the same substrate using sequential deposition layers, eliminating the need for separate manufacturing processes for each component type and dramatically increasing overall fabrication throughput
3Productivity
If thin film components are prefabricated on wafer substrate, then assembly speed and precision are improved, but additional fabrication steps are required
Solution Approach 1:
The patent applies universality by creating a multi-functional thin film component structure where single layers serve multiple purposes. For example, the same metal layer can provide both electrical connectivity and mechanical support, and the substrate serves as both the component mounting platform and the final circuit board interface. This multi-functionality reduces the number of separate fabrication steps needed compared to conventional multi-layer surface mounted components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Results in smaller, lighter, and less expensive electronic devices with improved assembly efficiency, reducing production time and costs.
Implementation Method 1
performing a solder reflow to electrically couple the one or more deposited thin film components onto the pads of the PCB assembly
Data Source
AI summary
Techniques are provided for fabrication of an electronic device. A methodology implementing the techniques according to an embodiment includes forming a plurality of thin film components on a wafer substrate. The method also includes cutting one or more of the thin film components from the wafer substrate and extracting the one or more of the thin film components from the wafer substrate. The method further includes depositing the extracted thin film components onto pads of a printed circuit board (PCB) assembly. The method further includes performing a solder reflow to electrically couple the one or more thin film components onto the pads of the PCB assembly. The thin film component comprises a release layer, solder layers, solder barrier layers, non-wetting solder barrier layers, a passivation layer, and a component function layer. The component function layer may provide a resistive function, a capacitive function, a diode function, or a thermocouple function.