Thin Film Penetration Depth Measurement Using Disposable Insert

Solution Overview

Problem

Conventional methods for testing and quantifying the conformality of thin films in semiconductor substrate processing, such as atomic layer deposition (ALD), are time-consuming and expensive, involving complex sample preparation and microscopy analysis.

Innovation Solution

A method involving an insert with grooves that forms spaces between the insert and a substrate, allowing precursor feeding into these spaces to determine penetration depth, which can be measured by analyzing the thin film coating formed on the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional testing procedures (fabricating test samples, SEM/TEM imaging) are used to determine thin film conformality, then measurement precision is improved, but loss of time and manufacturing cost increase significantly

Engineering Contradiction:

Improveconformality measurement precisionVSAvoidtesting duration

Core Design Contradiction:

Measurement precisionVSLoss of time

Solution Approach 1:

The invention creates a simplified test structure copy (test cavity with insert) that replicates the essential geometry needed for conformality assessment without requiring complex sample preparation. The test cavity mimics the critical features of actual device structures, allowing rapid evaluation using simpler optical microscopy instead of expensive SEM/TEM while maintaining sufficient measurement precision for process control

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The test structure uses a disposable or easily replaceable insert that can be quickly changed between tests. This eliminates the need for expensive, time-consuming sample preparation and allows multiple rapid measurements. The insert acts as a consumable test artifact that simplifies the overall measurement process and reduces both time and cost

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Measurement precision

If conventional testing procedures are used to determine thin film conformality, then measurement precision is improved, but manufacturing cost increases significantly

Engineering Contradiction:

Improveconformality measurement precisionVSAvoidprocess control cost

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

The invention creates a simplified test structure copy (test cavity with insert) that replicates the essential geometry needed for conformality assessment without requiring complex sample preparation. The test cavity mimics the critical features of actual device structures, allowing rapid evaluation using simpler optical microscopy instead of expensive SEM/TEM while maintaining sufficient measurement precision for process control

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The test structure uses a disposable or easily replaceable insert that can be quickly changed between tests. This eliminates the need for expensive, time-consuming sample preparation and allows multiple rapid measurements. The insert acts as a consumable test artifact that simplifies the overall measurement process and reduces both time and cost

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Measurement precision

If conventional testing procedures are used for process control, then measurement precision is improved, but productivity decreases due to extended downtime

Engineering Contradiction:

Improveprocess control accuracyVSAvoidproduction downtime

Core Design Contradiction:

Measurement precisionVSProductivity

Solution Approach 1:

The invention creates a simplified test structure copy (test cavity with insert) that replicates the essential geometry needed for conformality assessment without requiring complex sample preparation. The test cavity mimics the critical features of actual device structures, allowing rapid evaluation using simpler optical microscopy instead of expensive SEM/TEM while maintaining sufficient measurement precision for process control

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The test structures are prepared in advance as part of the standard wafer set, with inserts already in place. This preliminary preparation eliminates the need for post-deposition sample fabrication and preparation, allowing immediate measurement after deposition. The test cavities are pre-configured to receive the deposition, so no additional processing steps are needed before measurement

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables faster and more cost-effective process control and monitoring of thin film deposition, reducing downtime and allowing for more agile adjustments to the deposition process.

Implementation Method 1

The precursor(s) enter the spaces via diffusion

Methodology Applied

Scientific EffectDiffusion: Diffusion

Implementation Method 2

feeding the precursor(s) into the formed spaces by using an atomic layer deposition (ALD) sequence

Methodology Applied

Scientific EffectAtomic layer deposition: Chemical Vapour Deposition

Data Source

PatentUS20250198004A1Method, insert and apparatus for process control and monitoring of thin film deposition

Publication Date: 2025.06.19 PICOSUN OY

AI summary

A method for determining penetration depth of a thin film process precursor, comprising providing an insert (100), arranging the insert (100) to contact a substrate (200) to form a plurality of spaces (101) in between the insert (100) and the substrate (200), and feeding the precursor(s) into the formed spaces (101) to determine the penetration depth of the precursor.