Thin Film Resistor Layout via Multi-Layer Segmentation

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Solution Overview

Problem

The design of traditional thin film passive components requires large space areas, leading to inefficient layout designs in high-frequency electronic products, as the size and features of these components cannot meet the needs of miniaturization and high-frequency characteristics.

Innovation Solution

The integration of a thin film resistor structure composed of multiple rectangular segments, electrically connected through metal plugs or wiring at different layers, reduces the overall layout area while maintaining predetermined resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional thin film passive components are used, then the components can be manufactured with good workability, but large space areas are required leading to inefficient layout design

Engineering Contradiction:
ImproveworkabilityVSAvoidlayout area
Core Design Contradiction:
Ease of manufactureVSArea of stationary object

Solution Approach 1:

The thin film resistor structure is divided into multiple rectangular segments arranged in parallel, which are then electrically connected through metal plugs or wiring at different layers. This segmentation allows the resistor to achieve the required resistance value while occupying significantly less layout area compared to traditional single-structure thin film resistors.

Inventive Principle:
Principle #1Segmentation

2Area of stationary object

If the layout area of active components is shrunk to accommodate thin film passive components, then space utilization improves, but the design efficiency decreases

Engineering Contradiction:
Improvelayout areaVSAvoiddesign efficiency
Core Design Contradiction:
Area of stationary objectVSProductivity

Solution Approach 1:

The patent utilizes three-dimensional space by arranging multiple rectangular resistor segments in parallel and connecting them through metal plugs or wiring at different layers. This multi-layer approach allows the resistor structure to achieve compact footprint while maintaining design efficiency, as the vertical stacking reduces the horizontal layout area required.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9401358B1Semiconductor device structure
Publication Date: 2016.07.26 UNITED MICROELECTRONICS CORP
  • US9401358B1 patent drawing
  • US9401358B1 patent drawing
  • US9401358B1 patent drawing

AI summary

A semiconductor device structure having at least one thin-film resistor structure is provided. Through the metal plug(s) or metal wirings located on different layers, a plurality of stripe segments of the thin-film resistor structure is electrically connected to ensure the thin-film resistor structure with the predetermined resistance and less averting areas in the layout design.