Thin-Film Sensor Assembly for ESP Motor Windings
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Solution Overview
Problem
Existing downhole measurement sensors, particularly RTD probes, face challenges in being physically too large for insertion into motor windings due to their construction and are prone to damage during assembly and usage due to fragile lead wire connections.
Innovation Solution
A downhole measurement sensor assembly featuring a thin-film sensing element mounted on a rigid substrate with independent connection points to insulated lead wires, housed in a rugged, insulated enclosure made of high-temperature rated polytetrafluoroethylene, which minimizes size and enhances durability by using a printed circuit board as a connection member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wire-wound element or thin-film element is placed inside a stainless steel sheath enclosure with potting compound, then the sensing element is protected, but the RTD probe becomes physically too large to insert into motor windings
Solution Approach 1:
The patent removes the stainless steel sheath enclosure and potting compound from the RTD probe design, extracting only the essential protective functions. The sensing element is mounted directly on a small circuit board without the bulky metal sheath, dramatically reducing the probe size while maintaining functionality through alternative protection methods.
Solution Approach 2:
The patent replaces the rigid stainless steel sheath with a thin-film sensing element mounted on a flexible circuit board. This thin-film approach allows the probe to be sufficiently small for insertion into motor windings while still providing the necessary sensing capability and structural support.
2Ease of manufacture
If insulated lead wires are bonded to thin-film sensing element lead wires, then electrical connection is achieved, but the connection becomes easily damaged during assembly or usage
Solution Approach 1:
The patent introduces a rigid circuit board as an intermediary component between the thin-film sensing element and the insulated lead wires. The circuit board provides robust mechanical support and multiple independent connection points, mediating the connection in a way that protects the fragile thin-film leads while maintaining electrical connectivity and assembly ease.
Solution Approach 2:
The patent segments the connection structure into distinct functional parts: the thin-film sensing element, the rigid circuit board with multiple connection points, and the insulated lead wires. This segmentation allows each component to perform its specific function optimally while reducing stress on the fragile connections between them.
3Measurement precision
If the RTD probe is positioned adjacent to motor windings carrying high voltage and current, then temperature monitoring is achieved, but the probe must be electrically isolated in a non-metallic enclosure
Solution Approach 1:
The patent extracts the metallic enclosure from the design, removing the source of electrical isolation complexity. By using only non-metallic components (circuit board, polymer insulation, plastic housing), the probe achieves electrical isolation inherently without requiring an additional metallic barrier, simplifying the overall structure while maintaining safety near high-voltage windings.
4Volume of moving object
If a thin-wall thermoplastic polymer sleeve is used to house the thin-film element, then the probe size is reduced, but the probe becomes easily damaged during assembly or usage
Solution Approach 1:
The patent employs a composite structure combining multiple materials with complementary properties: a rigid circuit board for structural support, thin-film sensing element for measurement, polymer insulation for electrical protection, and a plastic housing for mechanical protection. This composite approach maintains small probe size while significantly enhancing durability through the synergistic properties of different materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for a compact, durable, and easily assembled sensor assembly that can withstand high pressures and voltages, reducing the risk of damage and ensuring accurate temperature monitoring within the downhole motor windings.
Implementation Method 1
a sensing element that may utilize the substantially linear relationship of resistance and the particular downhole parameter in order to monitor the bore-hole conditions
Implementation Method 2
housed in a rugged, insulated enclosure made of high-temperature rated polytetrafluoroethylene
Data Source
AI summary
The invention relates to a downhole measurement sensor assembly for an electrical submersible pump that is housed within a rugged, insulated and durable enclosure. The downhole measurement sensor assembly can be manufactured in accordance with the method described herein. The sensor assembly is configured to be inserted into a windings area of a downhole motor of the electrical submersible pump. The sensor assembly includes insulated lead wires that are connected to a thin-film temperature sensing element for monitoring the ESP motor operating temperature. The thin-film sensing element includes thin lead wires that are electrically connected via a connection substrate to the insulated lead wires. The thin-film sensing element is mounted the connection member, and the connection member may include attachment apertures for connecting the insulated lead wires.