Thin-Film Sensor Layout for High Light Transmittance

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Solution Overview

Problem

Existing thin film sensors, such as transparent antennas, face challenges in achieving high light transmittance due to the presence of conductive wires, which obstruct light passage and affect integration in transparent applications.

Innovation Solution

The thin film sensor design includes a base substrate with intersecting conductive wires forming hollow-out parts, and a functional structure with a first medium layer having a lower refractive index than the planarization layer. This configuration allows light to exit from the hollow-out parts, bypassing the conductive wires and enhancing light transmittance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive wires are used in thin film sensors, then electrical functionality is achieved, but light transmittance deteriorates due to wire obstruction

Engineering Contradiction:
Improveelectrical functionalityVSAvoidlight transmittance
Core Design Contradiction:
ReliabilityVSIllumination intensity

Solution Approach 1:

The patent introduces a third dimension by creating hollow-out parts that extend vertically from the substrate through the conductive wire layer. This vertical dimension allows light to bypass the conductive wires by traveling through the hollow spaces, effectively removing the wires from the light path while maintaining their electrical function in the horizontal plane.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The hollow-out parts act as intermediary channels that mediate between the conflicting requirements of electrical conductivity and optical transparency. These hollow spaces provide a pathway for light to pass through regions where conductive wires are present, allowing both electrical functionality and light transmittance to coexist.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Illumination intensity

If conductive wires are removed to improve light transmittance, then transparency is enhanced, but electrical functionality deteriorates

Engineering Contradiction:
Improvelight transmittanceVSAvoidelectrical functionality
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The conductive wire layer is segmented by creating hollow-out parts that remove portions of the wire layer vertically. This segmentation allows light to pass through the hollow spaces while the remaining wire structures maintain electrical connectivity. The segmentation creates a hybrid structure that combines conductive and transparent regions.

Inventive Principle:
Principle #1Segmentation

3Illumination intensity

If hollow-out parts are created to allow light passage, then light transmittance is improved, but device complexity increases

Engineering Contradiction:
Improvelight transmittanceVSAvoidstructure complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The hollow-out parts create a porous or perforated structure in the conductive wire layer. This porous architecture allows light to pass through while maintaining the overall integrity and electrical functionality of the conductive network. The porous structure is achieved through standard fabrication techniques, keeping complexity manageable.

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed design significantly increases light transmittance by allowing light to bypass the conductive wires, thereby improving the integration of thin film sensors in transparent applications without compromising their functionality.

Implementation Method 1

a refractive index of the first medium layer is less than that of the planarization layer; and the first medium layer includes a plurality of first main portions intersecting each other; and orthographic projections of the first main portions on the base substrate overlap those of the conductive wires on the base substrate respectively

Methodology Applied
Scientific EffectRefraction: Refraction

Data Source

PatentUS12222381B2Thin film sensor and manufacturing method thereof
Publication Date: 2025.02.11 BOE TECHNOLOGY GROUP CO LTD
  • US12222381B2 patent drawing
  • US12222381B2 patent drawing
  • US12222381B2 patent drawing

AI summary

The present disclosure provides a thin film sensor and a manufacturing method thereof, and belongs to the technical field of sensors. The thin film sensor of the present disclosure has a plurality of conductive-wire regions intersecting each other, and a plurality of hollow-out parts defined by the plurality of conductive-wire regions; the thin film sensor includes: a base substrate; a plurality of conductive wires on the base substrate, with the conductive wires being in the conductive-wire regions one to one; and a functional structure on the base substrate, where the functional structure is configured to allow at least part of light, which is transmitted along a preset direction and enters the functional structure from the conductive wire-regions, to exit from the hollow-out parts, and the preset direction is a direction from the base substrate towards the conductive wires.