Thin-Film Shield Layer for Electronic Component Noise Reduction
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Solution Overview
Problem
Existing electronic components with surface mount devices struggle to effectively reduce or prevent the radiation of low frequency noise, as this type of noise tends to propagate through metal shield layers and is often radiated from the edge portions, particularly due to current concentration and ground conductor connections.
Innovation Solution
The implementation of a thin-film shield layer using a nonmagnetic metal material covering the surface mount devices, combined with a magnetic metal thin-film shield layer that covers the edge portions of the nonmagnetic metal shield layer, creates a closed magnetic circuit and reduces noise radiation by guiding high frequency noise to the ground and shielding low frequency noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal film shield layer is disposed on the outermost layer to shield noise, then high frequency noise is reduced, but low frequency noise is radiated from the edge portion
Solution Approach 1:
The patent applies composite materials by combining a metal film shield layer with a magnetic film layer. The metal film provides high frequency noise shielding while the magnetic film covers the edge portions to prevent low frequency noise radiation. This composite structure leverages the complementary properties of different materials to address both high and low frequency noise issues simultaneously.
2Volume of moving object
If the metal film is made thinner to reduce component size, then miniaturization is achieved, but shielding effectiveness decreases
Solution Approach 1:
The patent uses composite materials consisting of a thin metal film layer and a magnetic film layer. This composite structure provides effective noise shielding even when the overall thickness is reduced, as the combination of materials compensates for the reduced individual layer thickness.
Solution Approach 2:
The patent employs thin film structures for both the metal shield layer and magnetic film layer. These thin films provide effective noise shielding while enabling miniaturization of the electronic component. The thin film approach allows achieving good shielding performance with minimal thickness.
3Object-affected harmful factors
If a thick metal shield layer is used to improve shielding, then noise reduction is enhanced, but manufacturing complexity and cost increase
Solution Approach 1:
The patent segments the shield structure into two distinct functional layers: a metal film shield layer for high frequency noise and a magnetic film layer for low frequency noise. This segmentation allows each layer to be optimized for its specific function and enables the use of thinner individual layers, reducing overall complexity compared to a single thick layer.
Solution Approach 2:
The patent uses composite materials with each layer having specific thickness and material properties optimized for its function. This composite approach provides effective shielding across different frequency ranges without requiring excessive thickness in any single layer, thereby reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces or prevents the radiation of both low and high frequency noise, improves adhesion and reliability, and allows for a thinner component design while maintaining effective shielding across a wide frequency band.
Implementation Method 1
The metal thin-film shield layer is formed by a thin-film process using a nonmagnetic metal material and entirely or substantially entirely covers the surface mount devices at the top surface side and the lateral surface side thereof
Implementation Method 2
The magnetic metal thin-film shield layer is formed by a thin-film process using a magnetic metal material and covers the top surface portion and the lateral surface portion of the metal thin-film shield layer
Data Source
AI summary
An electronic component including a thin-film shield layer includes a wiring substrate, surface mount devices mounted to a first principal surface of the wiring substrate, a metal thin-film shield layer, and a magnetic metal thin-film shield layer. The metal thin-film shield layer includes a nonmagnetic metal material and entirely covers the surface mount devices at the top surface side and lateral surface side thereof. The metal thin-film shield layer includes a top surface portion and a lateral surface portion. The magnetic metal thin-film shield layer includes a magnetic metal material and covers the top surface portion and the lateral surface portion of the metal thin-film shield layer, including an entire edge portion at which the top surface portion and the lateral surface portion are joined to each other.