Thin-Film Structure Factor Calculation Without Substrate Interference
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Solution Overview
Problem
Existing methods struggle to accurately calculate the structure factor of thin film samples formed on a substrate without introducing errors from the substrate's influence, as total scattering data includes contributions from both the substrate and the film.
Innovation Solution
A processing apparatus and method that acquires and processes first and second total scattering data to isolate the film's scattering data by subtracting the substrate's influence, using oblique X-ray incidence and absorption factor calculations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If total scattering measurement is performed on a thin film sample formed on a substrate, then measurement can be conducted without peeling the film, but the obtained data includes interference from the substrate
Solution Approach 1:
The patent segments the total scattering data into two components: substrate scattering and film scattering. By measuring the substrate separately and mathematically separating its contribution from the combined measurement, the film's structure factor can be extracted precisely without physical separation or peeling of the film from the substrate.
Solution Approach 2:
The patent extracts the substrate's scattering contribution from the total scattering data through mathematical operations. By measuring the substrate alone first, its scattering pattern is obtained and then removed from the combined substrate-film measurement, leaving only the film's scattering information for accurate structure factor calculation.
2Device complexity
If conventional total scattering measurement is used for thin films on substrates, then measurement is simplified, but substrate influence cannot be eliminated
Solution Approach 1:
The patent performs a preliminary measurement of the substrate alone before measuring the combined substrate-film sample. This preliminary action captures the substrate's scattering characteristics, which are then used to mathematically remove substrate interference from the combined measurement, preserving the pure film scattering information.
Solution Approach 2:
The patent uses the substrate's separately measured scattering data as an intermediary to eliminate substrate interference. By introducing this intermediate measurement data into the calculation process, the substrate's harmful influence is mathematically neutralized, allowing extraction of pure film structure information.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise calculation of the structure factor of thin films on substrates by minimizing substrate interference, ensuring high-precision measurement data.
Implementation Method 1
first total scattering data obtained by performing measurement for a first sample including the substrate and the film portion under a measurement condition of an X-ray being obliquely incident
Data Source
AI summary
A system capable of calculating a structure factor of a thin film formed on a substrate includes a measurement data acquiring section, a total scattering data calculating section, and a structure factor calculating section. The processing apparatus is configured to be capable of calculating a structure factor of a film formed on a substrate. The total scattering data calculating section acquires first total scattering data Isp and second total scattering data Isub from the measurement data acquiring section, and calculates total scattering data ITF of only a film portion based thereon. The total scattering data ITF of only the film portion is determined by subtracting a product of the second total scattering data Isub and an absorption factor Asub of the substrate from the first total scattering data Isp.