Thin-Film Wiring Substrate for Low-Loss High-Speed Signal Paths
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Solution Overview
Problem
In semiconductor devices, high-speed signal transmission through transmission wiring results in reflection loss and insertion loss due to the existing path structure.
Innovation Solution
A wiring substrate design with a thicker first conductive layer and a high-density thin film layer, where the transmission wiring is embedded in a thicker insulating layer with a lower dielectric loss tangent, reducing signal loss by optimizing the wiring resistance and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional transmission wiring path is used in semiconductor devices, then the wiring structure is simple and easy to manufacture, but reflection loss and insertion loss occur during high-speed signal transmission
Solution Approach 1:
The patent changes the physical parameters of the transmission wiring by making the first conductive layer thicker than the second conductive layer. This parameter change reduces wiring resistance and minimizes signal loss during high-speed signal transmission, directly addressing the energy loss problem while maintaining a manageable structural complexity
Solution Approach 2:
The patent applies local quality by creating a high-density thin film layer with specifically engineered properties in the region where high-speed signals are transmitted. This localized optimization of wiring density and conductive layer thickness reduces reflection loss and insertion loss at critical signal transmission points without requiring complete redesign of the entire wiring structure
2Reliability
If a thicker insulating layer with lower dielectric loss tangent is used, then insertion loss and reflection loss are suppressed, but the manufacturing process becomes more complex
Solution Approach 1:
The patent changes the dielectric parameter by selecting an insulating layer material with a lower dielectric loss tangent. This parameter change suppresses insertion loss and reflection loss, improving signal transmission quality and reliability while the thick-film fabrication process maintains compatibility with existing manufacturing capabilities
Solution Approach 2:
The patent employs composite material structure by combining a thicker first conductive layer with a thicker insulating layer having lower dielectric loss. This composite approach optimizes both electrical performance and signal integrity, achieving reliable high-speed signal transmission through the synergistic combination of multiple material properties
Data Source
AI summary
A wiring substrate includes a first insulating layer, a first wiring layer that is provided on the first insulating layer, and a thin film layer that is provided on one of surfaces of the first insulating layer and that includes a second insulating layer that is different from the first insulating layer and a second wiring layer. The thin film layer includes a first pad and a second pad that are provided on an opposite surface of a surface that faces the first insulating layer, a first via that is electrically connected to the first pad, and a second via that is electrically connected to the second pad. The first wiring layer includes thicker than the second wiring layer, and includes a transmission wiring that electrically connects between the first via and the second via.