Thin-Film Deposition Temperature Sensing Without Light Source Heat
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Solution Overview
Problem
Current thin-film deposition apparatuses face challenges in accurately measuring substrate temperature during the deposition process, which can affect the quality of thin films formed.
Innovation Solution
A thin-film deposition apparatus is designed with a housing, chamber, susceptor, reflector, light source, and temperature measuring devices that include a light receiver, optical cable, and sensor to measure substrate temperature by analyzing light transmitted from the substrate, with the sensor located outside the housing to avoid heat interference from the light source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the temperature measuring device is placed inside the chamber near the light source, then the temperature measurement can be performed directly on the substrate, but the measurement accuracy deteriorates due to heat interference from the light source
Solution Approach 1:
The sensor is extracted from the chamber interior and placed outside the chamber through an opening in the housing. This removes the sensor from the harmful thermal environment created by the light source while maintaining its ability to measure substrate temperature through optical means, thus resolving the contradiction between measurement accuracy and heat interference
Solution Approach 2:
An optical cable serves as an intermediary medium, transmitting light signals from the substrate to the sensor located outside the chamber. This intermediary allows the sensor to measure substrate temperature without being physically exposed to the high-temperature environment inside the chamber, eliminating heat interference while preserving measurement capability
2Object-affected harmful factors
If the sensor is placed outside the housing, then heat interference from the light source is eliminated, but the device complexity increases due to additional components like optical cables and openings
Solution Approach 1:
The opening in the housing serves multiple functions: it allows the optical cable to pass through for sensor connection, maintains the sealed environment of the chamber, and enables thermal isolation between the light source and sensor. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances temperature measurement accuracy and stability, ensuring precise temperature control and improved thin-film quality by separating the light source from the temperature measurement sensor.
Implementation Method 1
a light receiver disposed within the housing, spaced apart from the light source with a portion of the reflector therebetween, and having a hole through which light emitted from the substrate is introduced
Implementation Method 2
a sensor disposed outside the housing, connected to the optical cable, and configured to measure a temperature of the substrate by analyzing light transmitted from the optical cable
Implementation Method 3
a reflector disposed within the housing and disposed outside the chamber
Data Source
AI summary
A thin-film deposition apparatus includes: a housing; a chamber located within the housing and providing an internal space; a platform disposed within the chamber and configured to support a substrate; a reflector disposed within the housing and disposed outside the chamber; a light source disposed between opposing walls of the reflector and configured to radiate light onto the substrate; a light receiver disposed within the housing, spaced apart from the light source with a portion of the reflector therebetween, and having a hole through which light emitted from the substrate is introduced; an optical cable connected to the light receiver and extending to the outside of the housing; and a sensor disposed outside the housing, connected to the optical cable, and configured to measure a temperature of the substrate by analyzing light transmitted from the optical cable.