Thin-Film Temperature Sensor Structure for Narrow-Space Measurement
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Solution Overview
Problem
Existing thin temperature sensors face challenges in achieving sufficient thickness reduction while maintaining durability and ease of manufacturing, making them inadequate for certain temperature measurement targets and difficult to produce.
Innovation Solution
A temperature sensor design featuring a thermosensitive body sandwiched between two electric insulation supporting films, with lead patterns and conductive pads for electrical connection, allowing for reduced thickness and simplified manufacturing by using flexible printed circuits and anisotropic conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the temperature sensor is reduced in thickness to be inserted into narrow spaces, then the temperature sensor can measure temperature in extremely narrow spaces, but the work of manufacturing becomes not easy
Solution Approach 1:
The temperature sensor is divided into multiple functional layers including a sensor element layer, lead wire layer, and package layer. Each layer is manufactured and prepared separately before being assembled together, which simplifies the manufacturing process while achieving the required thin profile of 2mm or less
Solution Approach 2:
The sensor element and lead wires are nested within the package structure, with the package including two layers of insulation film that sandwich these components. This nested arrangement allows the entire assembly to be compact and thin while maintaining all necessary functional elements
2Length of moving object
If the temperature sensor is reduced in thickness to a certain level, then thickness reduction is achieved, but the temperature sensor cannot cope with certain temperature measurement targets
Solution Approach 1:
The temperature sensor design allows for flexible adaptation to different measurement targets through configurable package dimensions and sensor element positioning. The package can be adjusted in size and shape while maintaining the thin profile requirement, enabling the sensor to accommodate various measurement targets with different thermal and geometric characteristics
Solution Approach 2:
The sensor element is positioned at specific locations within the package structure to optimize thermal contact with different measurement targets. The package design provides localized thermal pathways that can be adjusted based on the specific measurement requirements, maintaining effectiveness across diverse applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a thickness of 0.5 mm or less, facilitates easy bonding, reduces material costs, and enables accurate temperature measurement in narrow spaces by positioning the thermosensitive body close to the measurement target.
Implementation Method 1
a thermosensitive body (11) having electric characteristics that change with temperature
Implementation Method 2
using flexible printed circuits and anisotropic conductive materials
Data Source
AI summary
A temperature sensor includes: a first supporting film made of an electric insulation material; a second supporting film that is made of an electric insulation material and is stacked on the first supporting film; and a sensor element provided between the first supporting film and the second supporting film. The sensor element includes a thermosensitive body having electric characteristics that change with temperature, and a first lead pattern and a second lead pattern that are electrically connected to the thermosensitive body. The first supporting film and the second supporting film are disposed to face each other in a region where the thermosensitive body is provided.


