Thin Film Integrated Circuit Transfer via Directional Etching
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Solution Overview
Problem
The challenge lies in efficiently manufacturing small semiconductor devices with thin film integrated circuits over a large glass substrate while preventing cracks during the peeling and transferring process, which is crucial for mass production and ensuring the devices can be handled and transported without damage.
Innovation Solution
The method involves forming a peeling layer over a substrate, a base insulating layer, and a thin film integrated circuit, followed by selective etching of the peeling layer in a controlled direction to prevent warping and cracking, and transferring the circuit to another substrate with an adhesive material, allowing for continuous handling and reuse of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If the peeling layer is etched from four directions to remove it completely, then the peeling layer is fully removed, but cracks are generated in the integrated circuit due to warping of the peeled layer
Solution Approach 1:
The etching process is segmented into two distinct stages: first etching from one direction to a predetermined depth without removing the peeling layer completely, then etching from the opposite direction to remove the remaining peeling layer. This segmentation prevents the peeled layer from warping excessively in any single direction, thereby preventing crack generation while still achieving complete peeling layer removal.
Solution Approach 2:
The preliminary etching from one direction creates a controlled initial removal of the peeling layer, establishing a stable configuration before the final etching from the opposite direction. This preliminary action prevents sudden warping and stress concentration that would occur with direct multi-directional etching.
2Volume of moving object
If the thin film integrated circuit is made extremely thin to reduce size, then the device size is reduced, but the circuit becomes difficult to handle and transport without damage
Solution Approach 1:
The extremely thin film integrated circuit is nested within a protective layer structure during manufacturing and handling. The protective layer acts as a container or housing that protects the fragile thin circuit during transport and handling operations, allowing the circuit to maintain its extremely thin profile while being robust during manipulation.
Solution Approach 2:
A flexible protective layer is applied over the thin film integrated circuit to provide mechanical protection during handling and transport. This protective shell maintains the thin profile of the device while preventing damage to the fragile circuit underneath during manipulation and transportation.
3Productivity
If multiple electronic component elements are mounted over a large glass substrate for mass production, then productivity increases, but the substrate becomes heavy and fragile
Solution Approach 1:
The manufacturing process segments the substrate usage into two phases: first, multiple integrated circuits are manufactured simultaneously on a large glass substrate to achieve mass production efficiency; then, the completed circuits are peeled off and transferred to a separate flexible support substrate. This segmentation allows the glass substrate to be reused for subsequent production batches, effectively distributing the weight and fragility burden across multiple production cycles.
Solution Approach 2:
The glass substrate is temporarily used during manufacturing and then discarded (peeled off) after the circuits are completed. The circuits are recovered and transferred to a flexible support substrate, allowing the glass substrate to be cleaned and reused for the next batch of productions, thereby amortizing the weight and fragility issues over multiple production cycles.
4Speed
If the peeling layer is etched deeply from multiple directions simultaneously, then the etching speed increases, but the peeled layer warps and cracks occur
Solution Approach 1:
The etching process is divided into two sequential stages rather than simultaneous multi-directional etching: first etching from one direction to a controlled depth, then etching from the opposite direction. This segmentation maintains manufacturing precision by preventing warping-induced cracks while still achieving efficient overall etching through the coordinated two-stage process.
Solution Approach 2:
The first etching direction performs a preliminary removal of the peeling layer to a predetermined depth, creating a stable intermediate state that prevents excessive warping. This preliminary etching action sets up the conditions for the second etching direction to complete the removal without causing cracks, thereby maintaining manufacturing precision throughout the high-speed process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces damage to the semiconductor integrated circuits, enables mass production, and allows for the continuous transportation and handling of thin film integrated circuits without scattering, enhancing the efficiency of the manufacturing process.
Implementation Method 1
etching the peeling layer
Implementation Method 2
an adhesive material is provided on the second substrate
Data Source
AI summary
In the case where an integrated circuit formed of a thin film is formed over a substrate and peeled from the substrate, a fissure (also referred to as crack) is generated in the integrated circuit in some cases. The present invention is to restrain the generation of a fissure by fixing the proceeding direction of etching in one direction to make a peeled layer warp in one direction in accordance with the proceeding of etching. For example, the proceeding of etching can be controlled by utilizing the fact that a portion where a substrate is in contact with a base insulating layer is not etched in the case of patterning a peeling layer provided over the substrate, then forming the base insulating layer, and then fixing a peeled layer by the portion where the substrate is in contact with the base insulating layer.