Thin-Film Ultrasonic Imager Array for Lower-Heat Imaging
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Solution Overview
Problem
Conventional ultrasound probes using bulk piezoelectric materials require high voltage pulses, leading to high power dissipation, heat generation, and manufacturing challenges, with transducers prone to failure and inefficiencies, and bulky designs causing muscular injuries to sonographers.
Innovation Solution
A two-dimensional array of piezoelectric elements with thin film layers and integrated ASIC chips for efficient signal processing, allowing lower voltage operation, reduced heat generation, and flexible interconnection, enabling high bandwidth and improved image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional bulk piezoelectric transducers are used, then high voltage pulses can be generated for imaging, but power dissipation and heat generation become excessively high
Solution Approach 1:
The patent divides the bulk piezoelectric material into multiple thin-film piezoelectric layers, each contributing to the overall acoustic output. This segmentation allows the system to achieve high power output through coordinated operation of multiple lower-power elements, reducing the power dissipation burden on any single element and overall system heat generation.
Solution Approach 2:
The patent transitions from thick bulk piezoelectric elements (one-dimensional thickness) to thin-film piezoelectric layers stacked in multiple layers (multi-dimensional structure). This dimensional change enables more efficient power distribution and heat dissipation across the transducer structure, reducing overall power dissipation while maintaining or enhancing power output capability.
2Force
If conventional bulk piezoelectric transducers are used, then sufficient acoustic pressure can be generated, but the probe weight increases causing muscular injuries
Solution Approach 1:
The patent segments the heavy bulk piezoelectric material into multiple thin-film layers that can be more efficiently supported by the substrate structure. This segmentation reduces the overall mass of piezoelectric material required while maintaining the acoustic pressure generation capability through the combined output of multiple elements.
Solution Approach 2:
The patent replaces the mechanical bulk piezoelectric structure with a micro-fabricated thin-film structure that achieves acoustic pressure generation through electromagnetic and piezoelectric effects in a much lighter configuration. This substitution dramatically reduces probe weight while maintaining or improving acoustic pressure output through more efficient energy conversion.
3Ease of manufacture
If conventional bulk piezoelectric elements are manufactured, then transducers can be built, but manufacturing costs and complexity increase due to precise cutting and mounting
Solution Approach 1:
The patent employs self-aligned fabrication processes where the thin-film piezoelectric layers are deposited and patterned directly on the substrate in their final positions. This self-service approach eliminates the need for separate precise cutting and mounting operations, as the elements are formed in-situ with automatic alignment to the substrate and interconnect structures.
Solution Approach 2:
The patent replaces mechanical cutting and mounting operations with micro-fabrication processes such as sputtering, chemical vapor deposition, and photolithography. These processes form the piezoelectric elements directly on the substrate with precise dimensional control, eliminating the need for post-fabrication mechanical assembly and significantly reducing manufacturing complexity.
4Reliability
If conventional transducers with high impedance are used, then they can operate independently, but impedance matching with transmit/receive electronics becomes difficult requiring additional networks
Solution Approach 1:
The patent merges the transducer elements into a closely integrated array where multiple thin-film piezoelectric elements are connected in parallel or series configurations directly on the substrate. This merging approach transforms the overall impedance characteristics of the transducer array to better match standard electronics impedance levels, eliminating or simplifying the need for external impedance matching networks.
Solution Approach 2:
The patent designs the thin-film piezoelectric transducer array to provide both sensing and actuation functions with standardized impedance characteristics that are universally compatible with common transmit/receive electronics. This multi-functionality with standardized interfaces reduces the need for specialized impedance matching networks and simplifies system integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing costs, minimizes heat generation, and enhances image quality by allowing simultaneous operation of multiple elements, increasing frame rates and reducing muscular injuries, while maintaining efficient signal transmission and reception.
Implementation Method 1
a piezoelectric layer; a bottom electrode disposed on a bottom side of the piezoelectric layer and configured to receive a transmit signal during a transmit mode
Implementation Method 2
develop an electrical charge during a receive mode
Data Source
AI summary
An imaging device includes a two dimensional array of piezoelectric elements. Each piezoelectric element includes: a piezoelectric layer; a bottom electrode disposed on a bottom side of the piezoelectric layer and configured to receive a transmit signal during a transmit mode and develop an electrical charge during a receive mode; and a first top electrode disposed on a top side of the piezoelectric layer; and a first conductor, wherein the first top electrodes of a portion of the piezoelectric elements in a first column of the two dimensional array are electrically coupled to the first conductor.