Thin-Film Support Structure for Precise Via Alignment
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Solution Overview
Problem
Existing technologies face challenges in miniaturizing devices while maintaining precision and reliability, particularly in physiological monitoring and microelectronics, due to difficulties in fabricating thin films that are stretchable, flexible, and breathable, and in aligning microelectronic structures without distortion during manufacturing.
Innovation Solution
The development of thin film support structures with a first carrier having an adhesive layer and a film attached to it, where the film is stretchable and the carrier maintains a given threshold distortion, allowing for precise registration and formation of vias and microelectronic structures without significant distortion during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If thin films are made stretchable and flexible for wearable devices, then device adaptability is improved, but manufacturing precision deteriorates due to distortion during processing
Solution Approach 1:
A carrier substrate is introduced as an intermediary between the stretchable thin film and the rigid processing equipment. The carrier provides mechanical support during manufacturing while allowing the thin film to maintain its stretchable properties. This mediator enables precise via alignment during processing while the thin film remains flexible for wearable applications.
Solution Approach 2:
The device structure is segmented into separate functional layers: a rigid carrier substrate for manufacturing stability, a stretchable thin film for flexibility and breathability, and an adhesive layer for bonding. This segmentation allows each layer to perform its specific function optimally without compromising the others during manufacturing and use.
2Adaptability or versatility
If via patterns are formed in stretchable films, then device functionality is improved, but pattern distortion occurs during manufacturing processes
Solution Approach 1:
The carrier substrate acts as a reference frame that maintains geometric stability during manufacturing. Vias are formed through the thin film while anchored to the rigid carrier, preventing distortion of the via pattern even when the thin film is stretched or processed at elevated temperatures.
Solution Approach 2:
The via patterns are formed in the thin film while it is still attached to the carrier substrate before final device assembly. This preliminary formation ensures precise via alignment is established early in the manufacturing process while the carrier provides structural support to maintain pattern accuracy.
3Ease of manufacture
If adhesive layers are used to attach thin films to carriers, then manufacturing stability is improved, but adhesion strength requirements increase
Solution Approach 1:
The adhesive layer parameters (thickness, material composition, curing conditions) are optimized to provide sufficient bond strength between the thin film and carrier while maintaining ease of manufacture. The adhesive layer is designed to balance mechanical bonding requirements with processing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the fabrication of stretchable, flexible, and breathable devices with minimal distortion, facilitating high-throughput manufacturing and reliable alignment of microelectronic structures, enhancing device performance and compliance in physiological monitoring and microelectronics.
Implementation Method 1
attaching the film to a first support structure, the first support structure comprising an adhesive layer formed over a first carrier, wherein attaching the film to the first support structure comprises bonding a first surface of the film to the adhesive layer of the first support structure
Data Source
AI summary
A method includes forming a film, forming a first pattern of two or more vias at least partially through the film, attaching the film to a first support structure, the first support structure comprising an adhesive layer formed over a first carrier, wherein attaching the film to the first support structure comprises bonding a first surface of the film to the adhesive layer of the first support structure, wherein the film is stretchable in at least a first direction along the first surface, and wherein the first carrier maintains the first pattern of vias within a given threshold distortion following a given process conducted after attaching the film to the first support structure.