Multilayer Thin-Film FPCB Laser Sintering for Fast Patterning
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Solution Overview
Problem
Conventional methods for manufacturing flexible printed circuit boards (FPCBs) are costly and time-consuming, requiring high-temperature processes and limited to specific substrates, while display devices face challenges with weight, volume, and heat management due to thick insulating layers and high heat capacity.
Innovation Solution
A method using visible/ultraviolet lasers to pattern and form via holes on thin film flexible substrates at room temperature and atmospheric pressure, enabling the production of multilayer thin FPCBs and ultra-thin film heaters with thermochromic resins for rapid temperature control and reduced heat loss, utilizing metal nanoparticles and nanowires with laminated structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional metal deposition, light exposure using mask, and etching methods are used to manufacture FPCB, then the FPCB can be manufactured with high precision patterns, but the manufacturing process becomes complicated, time-consuming, and costly
Solution Approach 1:
The patent extracts and removes the mask and etching steps from the conventional FPCB manufacturing process. Instead of using masks for light exposure and subsequent etching, the invention directly forms conductive patterns by depositing metal nanoparticles and sintering them with laser irradiation, eliminating the need for masks and complex etching procedures while maintaining pattern precision
Solution Approach 2:
The patent replaces the mechanical and chemical etching system with a laser-based sintering system. Conventional methods use mechanical mask alignment and chemical etchants, while the invention uses laser irradiation to directly sinter metal nanoparticles into conductive patterns, significantly simplifying the process and reducing manufacturing time
2Stability of the object's composition
If conventional high temperature manufacturing processes are used, then the FPCB can be manufactured with stable patterns, but the substrate material is limited to polyimide and high heat resistance materials, preventing use of thin film substrates
Solution Approach 1:
The patent changes the temperature parameter from conventional high temperature (required for polyimide substrates) to room temperature or low temperature processing. By using laser sintering of metal nanoparticles, the invention achieves stable conductive patterns without requiring high temperatures, thereby enabling the use of thin film flexible substrates and expanding substrate material selection
Solution Approach 2:
The patent utilizes the phase transition of metal nanoparticles from dispersed state to sintered conductive state through laser irradiation. This phase transition occurs at low temperatures, replacing the high-temperature sintering required in conventional processes, and enables processing on temperature-sensitive thin film substrates
3Stability of the object's composition
If thick insulating layers and tens of micrometers metal layers are used in film-type heaters, then the heater structure is stable, but the heat capacity per unit area is high and temperature change is slow, limiting rapid temperature control
Solution Approach 1:
The patent replaces thick insulating layers and metal layers with ultra-thin film structures. By using thin film heaters with thickness of several micrometers or less, the invention reduces heat capacity per unit area while maintaining structural stability, enabling rapid temperature control and response
Solution Approach 2:
The patent changes the thickness parameter of the heater structure from tens of micrometers to several micrometers or less. This parameter change reduces the heat capacity per unit area, allowing the heater to achieve rapid temperature changes and improve temperature control speed while maintaining adequate structural stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and time, allows for high-resolution imaging, and minimizes heat loss by enabling rapid heat transfer in a vertical direction, using inexpensive materials and achieving thin, flexible, and high-resolution displays.
Implementation Method 1
applying a laser to the metal nanoparticles to sinter the metal nanoparticles and pattern them
Implementation Method 2
applying a laser to the metal nanoparticles to sinter the metal nanoparticles and pattern them
Implementation Method 3
forming a via hole on the second flexible substrate using a laser
Data Source
AI summary
The present invention relates to a method for manufacturing a multilayer thin FPCB, and the method for manufacturing a multilayer thin FPCB according to the present invention relates to a method for manufacturing an FPCB (Flexible Printed Circuit Board) comprising coating metal nanoparticles on a first flexible substrate of a thin film; applying a laser to the metal nanoparticles to sinter the metal nanoparticles and pattern them; cleaning the metal nanoparticles unsintered; laminating a second flexible substrate of a thin film on the first flexible substrate in which a pattern is formed; forming a via hole on the second flexible substrate using a laser; coating metal nanoparticles on the second flexible substrate; applying a laser to the metal nanoparticles to sinter the metal nanoparticles and pattern them; and cleaning the metal nanoparticles unsintered.