Thin Glass Resin Laminate Cutting to Prevent Bonding Air Bubbles
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Solution Overview
Problem
Thin glass resin laminates processed using laser technology often experience air bubble formation when bonded to an adherend, particularly at the end portions, which is difficult to resolve with existing methods and affects product quality and yield.
Innovation Solution
A method involving laser processing of thin glass resin laminates with a specific thickness and creep characteristic of the pressure-sensitive adhesive layer, where the thickness of the adhesive layer is 10 μm or more and the creep characteristic is 100 μm/Hr or more, to prevent air bubble occurrence during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser processing is used to cut thin glass resin laminate, then cutting speed and end surface quality are improved, but air bubbles occur in the pressure-sensitive adhesive layer when bonded to adherend
Solution Approach 1:
The invention changes the physical-chemical parameters of the pressure-sensitive adhesive layer by establishing specific relationships between thickness and creep characteristic ((thickness)²×creep characteristic≥50×10³). This parameter optimization allows the adhesive layer to properly accommodate laser-induced stress and prevent air bubble formation during bonding, thus resolving the contradiction between cutting efficiency and bonding quality
Solution Approach 2:
The invention performs preliminary action by pre-setting the appropriate thickness and creep characteristic of the pressure-sensitive adhesive layer before laser processing and bonding. This preliminary configuration ensures that the adhesive layer has sufficient deformation capacity to handle subsequent processing stresses, preventing air bubble formation during the bonding stage
2Reliability
If the thickness of the pressure-sensitive adhesive layer is increased to prevent air bubbles, then bonding quality improves, but the overall laminate thickness and weight increase
Solution Approach 1:
The invention optimizes the thickness parameter of the pressure-sensitive adhesive layer to a specific range (preferably 10-50 μm) and correlates it with the creep characteristic. This optimized parameter combination achieves effective air bubble prevention while minimizing the increase in overall laminate thickness and weight
Solution Approach 2:
The invention uses a composite structure consisting of thin glass, resin layer, and pressure-sensitive adhesive layer with specifically controlled properties. This composite design allows the thin adhesive layer (10-50 μm) to provide sufficient deformation capacity through optimized creep characteristics, preventing air bubbles without significantly increasing weight
3Reliability
If conventional cutting methods (e.g., end mill) are used instead of laser processing, then air bubbles are prevented, but cutting speed and productivity decrease
Solution Approach 1:
The invention changes the parameters of the pressure-sensitive adhesive layer (thickness and creep characteristic) to be compatible with laser processing. This parameter optimization allows the adhesive layer to accommodate laser-induced stresses without forming air bubbles, enabling the use of high-speed laser cutting while maintaining bonding quality
Solution Approach 2:
The invention enables substitution of mechanical cutting (end mill) with laser processing by optimizing the adhesive layer parameters. The modified adhesive layer properties allow laser processing to achieve both high cutting speed and bonding quality, replacing the need for slower mechanical cutting methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents air bubble formation in the pressure-sensitive adhesive layer when bonding the thin glass resin laminate pieces to an adherend, enhancing the end surface quality and handleability of the laminate pieces.
Implementation Method 1
laser processing has been suitably adopted as a method by which both of tact and end surface quality (handleability) can be achieved
Data Source
AI summary
Provided is a method of producing a thin glass resin laminate piece, which includes cutting a thin glass resin laminate through laser processing, and by which a thin glass resin laminate piece capable of preventing the occurrence of air bubbles when bonded to an adherend can be obtained. The method of producing a thin glass resin laminate piece of the present invention includes a step of subjecting a thin glass resin laminate including a thin glass, a resin layer, and a pressure-sensitive adhesive layer in the stated order to laser processing to cut the laminate, wherein a thickness (μm) of the pressure-sensitive adhesive layer and a creep characteristic (μm/Hr) of the pressure-sensitive adhesive layer have a relationship of (thickness (μm))2×creep characteristic (μm/Hr)≥50×103 (μm2·μm/Hr).