Thin Glass Substrate Carrier Plate Separation Method
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Solution Overview
Problem
Existing manufacturing equipment is unable to effectively process semiconductor devices on glass substrates thinner than 0.3 mm due to insufficient rigidity and the formation of silicon and oxygen bonds between thin glass and carrier plates during high-temperature processes, leading to difficulties in separation and recycling.
Innovation Solution
A method involving the use of interlayers on carrier plates and glass substrates, where a first interlayer is formed on a carrier plate, a glass substrate is disposed on it, and a device layer is formed, followed by the use of a second interlayer and substrate, allowing for the separation of glass substrates from their respective interlayers to produce a display device that meets large-scale, thin, and lightweight requirements using existing equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the thickness of the glass substrate is reduced to 0.3 mm or less to meet thin and lightweight requirements, then the display device achieves thinness and lightweight characteristics, but the glass substrate becomes too thin and lacks sufficient rigidity for existing manufacturing equipment to process semiconductor devices on it
Solution Approach 1:
The patent introduces a carrier plate as an intermediary support structure that temporarily supports the thin glass substrate (0.3 mm or less) during the semiconductor device formation process. The carrier plate provides the necessary rigidity and stability for manufacturing equipment to process devices on the thin substrate, which would otherwise be too flexible and difficult to handle. After the semiconductor devices are formed, the carrier plate is separated from the thin glass substrate, allowing the final thin and lightweight display device to be achieved.
2Strength
If a thin glass substrate is attached to a glass carrier plate to increase rigidity, then the glass substrate gains sufficient rigidity for processing, but silicon and oxygen bonds form between the carrier plate and thin glass during high temperature processes, making separation difficult
Solution Approach 1:
The patent extracts and removes the problematic silicon-oxygen bond formation mechanism by avoiding direct contact between the glass carrier plate and the thin glass substrate during high-temperature processes. Instead, the thin glass substrate is attached to the carrier plate using an adhesive layer that does not form strong chemical bonds at high temperatures, allowing easy separation after device formation without the difficulty caused by silicon-oxygen bond formation.
3Strength
If glue material is used to attach the thin glass substrate to the glass carrier plate, then the substrate gains rigidity for processing, but general glue materials have poor heat resistance causing excess glue or bubbles during coating and reducing recycling efficiency
Solution Approach 1:
The patent changes the key parameter of the adhesive material by selecting a glue material with high heat resistance capability that can withstand the high-temperature processes (above 250°C) required for semiconductor device formation. This high-heat-resistant adhesive maintains its structural integrity during coating without forming excess glue or bubbles, and allows for clean separation after processing, thereby improving both the reliability of the attachment and the recyclability of the carrier plate.
Data Source
AI summary
A substrate unit, a display device, and a method for manufacturing the display device are disclosed. The method for manufacturing the display device includes the steps of: providing a first carrier plate and forming a first interlayer on the first carrier plate; disposing a first glass substrate on the first interlayer to form a first substrate unit; forming a first device layer on the first glass substrate to obtain a first device substrate; providing a second carrier plate and forming a second interlayer on the second carrier plate; disposing a second glass substrate on the second interlayer to form a second substrate unit; combining the first device substrate with the second substrate unit; separating the first glass substrate from the first interlayer; and separating the second glass substrate from the second interlayer to obtain the display device.