Thin Glass Substrate Handling via Supplementary Support and Inert Gas
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Solution Overview
Problem
Existing methods for reducing the thickness and weight of liquid crystal display (LCD) devices face challenges, particularly with the core components like glass substrates, which are prone to bending and breakage due to their small thickness, making it difficult to fabricate lightweight and thin LCDs without damaging the substrates during processing.
Innovation Solution
A method involving supplementary substrates attached to thin glass substrates before processing, where inactive gases are used to reduce the adhesive force between the substrates, allowing for easier handling and separation without damage, and enabling the use of thinner glass substrates with enhanced bending characteristics, similar to standard substrates, thereby minimizing deformation and damage during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If the thickness of glass substrates is reduced to make LCD devices thinner and lighter, then the weight and thickness of the LCD device are reduced, but the substrates become prone to bending and breakage during processing
Solution Approach 1:
The invention divides the substrate handling process into two stages: first, a supplementary substrate is attached to the thin glass substrate to provide structural support during processing; second, after processing is complete, the supplementary substrate is separated from the thin glass substrate. This segmentation allows the thin substrate to be handled safely during manufacturing while achieving the desired thinness and light weight in the final product.
Solution Approach 2:
The supplementary substrate acts as an intermediary element that temporarily supports the thin glass substrate during the processing phase. It provides the necessary mechanical strength and stability without being part of the final LCD device structure, thereby enabling the use of thinner substrates while preventing bending and breakage during manufacturing.
2Length of stationary object
If the thickness of glass substrates is reduced to make LCD devices thinner and lighter, then the weight and thickness of the LCD device are reduced, but the substrates become prone to bending and breakage during processing
Solution Approach 1:
The substrate handling process is segmented into two phases: attachment of supplementary substrate before processing, and separation after processing. This allows the thin substrate to maintain stability during manufacturing while achieving reduced thickness in the final device.
Solution Approach 2:
The supplementary substrate serves as a temporary intermediary that provides structural support to thin glass substrates during processing, preventing bending and breakage. After processing, it is removed, leaving the thin substrate intact and functional in the final LCD device.
3Reliability
If supplementary substrate is attached to thin glass substrate to prevent bending and breakage, then substrate stability is improved, but adhesive force between substrates may cause damage during separation
Solution Approach 1:
The invention changes the surface energy parameters of the supplementary substrate by treating it with a low surface energy coating or plasma treatment. This modification reduces the adhesive force between the supplementary substrate and the thin glass substrate, allowing for easy separation after processing without causing damage to either substrate.
Solution Approach 2:
The invention creates a low surface energy environment on the supplementary substrate through plasma treatment or coating, which acts as an inert layer that reduces adhesion. This allows the supplementary substrate to be easily separated from the thin glass substrate after the processing phase without exerting damaging adhesive forces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the successful fabrication of lightweight and thin LCDs by reducing the adhesive force between the supplementary and glass substrates, preventing damage and deformation, and enabling the use of thinner glass substrates with improved bending characteristics, thus overcoming the limitations of existing methods.
Implementation Method 1
spraying gas onto at least one surface of the first supplementary substrate and the thin first mother substrate, and thereby removing OH groups from the surface
Data Source
AI summary
Disclosed is a method for fabricating a lightweight and thin liquid crystal display (LCD) device, using a supplementary substrate for processing of a thin glass substrate. Inactive gas is sprayed onto the surface of the substrate to thus remove OH groups from the surface, before the thin glass substrate and the supplementary substrate are attached to each other. Under such configuration, the supplementary substrate can be easily separated from a completed liquid crystal panel which is in an attached cell state, without any damages.