Thin Glass Through-Hole Wiring During Etching and Thinning
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Solution Overview
Problem
The formation of through holes in glass substrates with a thickness of 300 μm or less can lead to mechanical strength deterioration and cracking, making it difficult to handle and process these substrates for electronic devices, and existing dry etching methods are inefficient and impractical for glass substrates.
Innovation Solution
A method involving the formation of through holes in a glass substrate by etching while thinning it, using a support body and laser-modified areas, with the holes having a truncated cone shape and specific diameter ratios, allowing for easier handling and stable production of glass devices with conductive portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If through holes are formed in glass substrates with thickness of 300 μm or less, then glass devices with thin substrates can be manufactured, but mechanical strength deteriorates and cracks occur
Solution Approach 1:
A support body is attached to the glass substrate before through hole formation to provide mechanical support during the etching process. This preliminary support prevents cracks and maintains substrate strength while enabling the formation of through holes in thin glass substrates (300 μm or less).
Solution Approach 2:
The support body acts as an intermediary element between the etching process and the glass substrate. It provides the necessary mechanical support during through hole formation, allowing the etching to proceed without causing substrate failure, and is later removed after serving its protective function.
2Manufacturing precision
If dry etching is used to form through holes in glass substrates, then through holes can be formed, but the process takes a long time and is impractical
Solution Approach 1:
The patent replaces the mechanical dry etching process with a wet etching process using hydrofluoric acid. This substitution dramatically reduces etching time while maintaining through hole formation capability, making the process practical for manufacturing glass substrates of 300 μm or less thickness.
3Length of moving object
If glass substrates with thickness of 300 μm or less are used, then smaller and more integrated glass devices can be manufactured, but handling and processing become difficult
Solution Approach 1:
The support body is attached in advance to provide mechanical reinforcement to thin glass substrates (300 μm or less) before and during processing. This preliminary support makes handling and processing of thin substrates easy and stable, overcoming the inherent fragility of thin glass.
Solution Approach 2:
The support body serves as an intermediary that facilitates easy handling of thin glass substrates during manufacturing processes. It provides the necessary mechanical stability for processing and is subsequently removed, leaving the finished thin glass device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the easy manufacturing of glass devices with glass substrates of 300 μm or less thickness by forming through holes during the etching process, improving handling and production stability of glass devices with conductive features.
Implementation Method 1
a modified area is formed in the glass substrate by irradiation with a laser beam
Implementation Method 2
the through holes are formed while the glass substrate is being thinned by etching
Data Source
AI summary
A glass device including a thin glass substrate which has a glass thickness of 300 μm or less is enabled to be provided more easily. In a method for manufacturing the glass device, one or more through holes are formed in a glass substrate, and a first wiring on a first surface side of the glass substrate and a second wiring on a second surface side of the glass substrate are electrically connected to each other via the through holes. After the first wiring is provided, the through holes are formed while the glass substrate is being thinned by etching. Then, wirings in the through holes and the second wiring are formed. The thinned glass substrate has a thickness of 50 μm or more and 300 μm or less. The through holes have the shape of a truncated cone.