Thin Heat Pipe Channel Structure for Ultra-Slim Cooling
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Solution Overview
Problem
Traditional heat pipes for portable electronic devices are limited by their thickness due to capillary structures, which increase manufacturing costs, complicate the process, and restrict heat transfer efficiency, making them unsuitable for modern, compact devices.
Innovation Solution
A thin heat dissipation device with a novel capillary structure featuring first and second fluid channels with a low interface height, allowing for efficient fluid circulation without traditional capillary structures, and a manufacturing method that simplifies production by stamping and eliminates the need for etching or sintering, enabling a thinner design with enhanced heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional capillary structures (meshes, fibers, sintered powders) are used in heat pipes, then sufficient working fluid circulation is achieved, but manufacturing cost increases and manufacturing process becomes complicated
Solution Approach 1:
The patent removes the traditional capillary structure (meshes, fibers, sintered powders) from the heat pipe design and replaces it with groove structures formed directly on the inner wall of the heat pipe. This extraction eliminates the need for separate capillary components and their associated attachment processes (heating for adhesion, sintering, annealing), thereby reducing manufacturing cost and process complexity while maintaining working fluid circulation capability
Solution Approach 2:
The patent merges the capillary function with the heat pipe wall structure by forming grooves directly on the inner wall. The groove structures serve dual purposes: they provide the capillary action for working fluid return and form an integrated part of the heat pipe body. This merging eliminates the need for separate capillary components and their attachment processes, reducing manufacturing complexity
2Reliability
If traditional capillary structures are used in heat pipes, then working fluid circulation is maintained, but device thickness cannot be reduced
Solution Approach 1:
The patent transitions from using three-dimensional capillary structures (meshes, fibers, sintered powders) that occupy significant volume to two-dimensional groove structures formed on the inner wall surface. This dimensional change allows the capillary function to be achieved with minimal thickness, enabling the heat pipe to be made thinner while maintaining working fluid circulation capability
Solution Approach 2:
The groove structures are formed as thin-film features on the inner wall of the heat pipe, allowing the overall device thickness to be reduced. The grooves provide sufficient capillary action without requiring the volume of traditional three-dimensional capillary structures, enabling thinner device design
3Length of stationary object
If groove depth is limited by pipe wall thickness, then device can be thinned, but heat transfer efficiency is limited due to limited condensed working fluid amount
Solution Approach 1:
The patent extends the grooves in the longitudinal direction (along the heat pipe axis) to compensate for the limited depth available due to thin wall thickness. This dimensional extension ensures sufficient volume for condensed working fluid storage and heat transfer while maintaining the thin overall device profile, resolving the conflict between thickness reduction and heat transfer efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a reliable, cost-effective, and durable thin heat dissipation device with improved heat transfer efficiency and reduced thickness, suitable for mass production and integration into portable electronic devices.
Implementation Method 1
a first fluid channel and a second fluid channel which are communicated with each other; an interface between the first fluid channel and the second fluid channel has a height of about 0.1 mm or less
Data Source
AI summary
The present invention is related to a thin heat dissipation device and a method for manufacturing the same. The device of the present invention mainly comprises a hollow body having an enclosed chamber and a working fluid with which the enclosed chamber is filled. The enclosed chamber comprises a first fluid channel and a second fluid channel. The first and second fluid channels extend in the longitudinal direction of the hollow body, are juxtaposed in the width direction of the hollow body and communicated with each other, and an interface between the first fluid channel and the second fluid channel has a height of about 0.1 mm or less. As such, a novel capillary structure which is capable of greatly reducing the entire thickness, enhancing heat transfer efficiency and reducing cost and which is reliable and durable is provided.