Thin Heating Device for Memory Module Burn-In Testing
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Solution Overview
Problem
Conventional burn-in testing methods for memory modules, motherboards, and processors involve simultaneous heating, which can shorten the durability and cause malfunctions of these components, leading to distorted test results.
Innovation Solution
A thin heating device comprising two circuit boards connected by an elastic connector and a heating element, allowing for targeted heating of the device under test (DUT) without simultaneously heating the motherboard and processor, thereby reducing the risk of malfunctions and improving test accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If memory modules, motherboards and processors are heated together in conventional burn-in testing, then the testing can be performed in a unified high-temperature environment, but the durability of motherboards and processors is shortened and malfunctions may occur
Solution Approach 1:
The heating function is segmented from the general oven environment and localized to only the memory module through the thin heating device. The heating device includes a heating element that directly contacts the memory module while the motherboard and processor remain at room temperature, thus segmenting the thermal treatment to protect sensitive components while maintaining testing productivity.
Solution Approach 2:
High temperature is applied locally only to the memory module under test rather than uniformly to all components. The thin heating device creates a localized high-temperature zone at the memory module position while the surrounding motherboard and processor operate in normal temperature conditions, achieving local quality differentiation to protect durability.
2Measurement precision
If simultaneous heating of all components is performed, then the test environment is simplified, but the probability of malfunctions increases and test results become distorted
Solution Approach 1:
The testing system is segmented into two independent thermal zones: a heated zone for the memory module and a non-heated zone for the motherboard and processor. This segmentation allows accurate measurement of memory module performance under high temperature without interference from thermal malfunctions of other components, improving measurement precision.
Solution Approach 2:
The thin heating device acts as an intermediary component between the power source and the memory module, providing controlled thermal treatment only where needed. This intermediary device isolates the thermal effect to the memory module, preventing malfunctions in other components and ensuring accurate test results.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prolongs the durability of motherboards and processors by avoiding high-temperature exposure during testing, decreases the probability of malfunctions, and enhances the accuracy of memory module test results by ensuring precise temperature control and better thermal conduction.
Implementation Method 1
The elastic connector connects to the first circuit board and the second circuit board so that the first circuit board and the second circuit board hold a DUT (device under test) by a return force of the elastic connector
Implementation Method 2
The heating element is disposed on the first circuit board or the second circuit board and is used for heating the DUT
Data Source
AI summary
A thin heating device is provided. The thin heating device includes a first circuit board, a second circuit board, an elastic connector and a heating element. The first and second circuit boards are face-to-face arranged. The elastic connector connects the first and second circuit boards to apply a return force to hold an under-tested device. The heating element is mounted on the first or the second circuit board to heat the under-tested device.