Ultra-Thin Heating Plate With Through Proximity Pin Support
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Solution Overview
Problem
Existing heating plates in semiconductor processing have high heat capacity, leading to slow heating and cooling, and attempts to create ultra-thin heating plates face manufacturing challenges such as space limitations and stress concentration, making it difficult to integrate proximity pins effectively.
Innovation Solution
A substrate processing apparatus with a through proximity pin that passes through a through-hole in the heating plate, featuring a head for point contact with the substrate, a first fixed portion for support, and a second fixed portion for secure attachment, allowing for reduced thickness and improved heat dissipation, and using materials like PEEK for low thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a conventional heating plate with heater pattern is used, then heating capability is provided, but heat capacity is high causing slow heating and cooling
Solution Approach 1:
The patent applies this principle by using an ultra-thin heating plate with thickness of 0.5mm or less, replacing the conventional thick heating plate. The thin plate structure significantly reduces heat capacity while maintaining heating functionality, enabling rapid heating and cooling cycles required for semiconductor manufacturing processes.
Solution Approach 2:
The patent changes the critical parameter of plate thickness from conventional dimensions to 0.5mm or less. This parameter change fundamentally alters the thermal properties, reducing heat capacity and improving thermal response speed without compromising structural integrity or heating performance.
2Speed
If the heating plate is made ultra-thin to reduce heat capacity, then heating and cooling speed improves, but installation area for proximity pin becomes too narrow
Solution Approach 1:
The patent resolves this contradiction by transitioning from a surface-mounted proximity pin configuration to a through-hole configuration. The through-hole extends vertically through the ultra-thin plate, creating a three-dimensional installation path that bypasses the limitation of narrow surface area, allowing sufficient installation space while maintaining ultra-thin profile.
Solution Approach 2:
The proximity pin is inserted through the through-hole and positioned within the ultra-thin heating plate structure. This nested configuration allows the proximity pin to be integrated into the plate thickness dimension, utilizing the vertical space rather than consuming valuable surface area.
3Ease of manufacture
If groove is formed only on upper surface of ultra-thin heating plate, then proximity pin installation is attempted, but stress concentrates causing cracks
Solution Approach 1:
The patent divides the stress distribution by creating a through-hole that extends through the entire thickness of the ultra-thin heating plate rather than forming a groove only on the surface. This segmentation of the stress path allows stress to be distributed along the vertical axis through the plate, preventing stress concentration at the surface level that would cause cracks.
4Shape
If integrated proximity protrusion is formed on upper surface, then substrate spacing is achieved, but cracks occur due to uneven load on ultra-thin plate
Solution Approach 1:
The patent extracts the proximity pin from an integrated surface-mounted configuration and creates a separate through-hole structure. This separation allows the proximity pin to be independently positioned and loaded, transferring the load path through the center of the plate via the through-hole rather than creating uneven stress distribution on the surface, thereby preventing cracks in the ultra-thin structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick and uniform heating of substrates, reduces thermal stress, and simplifies assembly by minimizing contact area and stress concentration, while maintaining precise control over substrate positioning.
Implementation Method 1
a heating plate for heating a substrate
Implementation Method 2
using materials like PEEK for low thermal conductivity
Data Source
AI summary
Disclosed is a substrate processing apparatus that allows a substrate to be supported on an ultra-thin heating plate so as to be spaced from the ultra-thin heating plate in a proximity manner. The substrate processing apparatus includes a heating plate for heating a substrate; and a through proximity pin installed in the heating plate so as to pass through a through-hole formed in the heating plate such that the substrate is spaced from the heating plate by a spacing via the through proximity pin.