Thin Insulating Substrate Resistor for Medical Sensors
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Solution Overview
Problem
The challenge lies in fabricating an insulating substrate with a thickness of 100 μm or less for electronic components without breaking, while ensuring high strength and biocompatibility for medical devices that require accurate temperature detection, as ceramic substrates are brittle and prone to cracking.
Innovation Solution
A resistor and temperature sensor design featuring an insulating substrate with a bending strength of 690 MPa or more, formed from materials like zirconia, silicon nitride, or alumina, with a thickness of 10 μm to 100 μm, and a resistive film covered by a protective film, allowing for reduced thickness and suppressed cracking, and using biocompatible materials for direct contact with living tissues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the insulating substrate is reduced to 100 μm or less, then the device thickness is reduced and biocompatibility is improved, but the substrate may break during fabrication and mounting
Solution Approach 1:
The patent changes the material parameters of the insulating substrate by specifying a bending strength of 690 MPa or more, which is a significant improvement over conventional ceramic substrates. This parameter change allows the substrate to maintain high strength even at reduced thicknesses of 10 μm to 100 μm, preventing breakage during fabrication and mounting while achieving the desired thin profile for medical devices.
Solution Approach 2:
The patent employs composite material structures by combining the high-strength insulating substrate with biocompatible materials for direct living body contact portions. This composite approach allows different regions of the device to have optimized properties: the substrate provides mechanical strength and insulation, while the biocompatible materials provide safety for medical applications, resolving the contradiction between thinness and reliability.
2Strength
If conventional ceramic substrates are used, then the substrate has sufficient strength, but the thickness cannot be reduced to 100 μm or less without breaking
Solution Approach 1:
The patent fundamentally changes the material parameters by requiring a bending strength of 690 MPa or more, which is substantially higher than conventional ceramic substrates. This parameter change enables the substrate to be made extremely thin (10 μm to 100 μm) while maintaining sufficient strength to prevent breakage during fabrication and mounting processes, thereby resolving the contradiction between strength and thickness reduction.
3Reliability
If biocompatible materials are used for direct contact with living body, then safety is improved, but the substrate strength may be reduced
Solution Approach 1:
The patent applies local quality by differentiating material properties in different regions of the device. The insulating substrate uses high-strength materials with bending strength of 690 MPa or more to provide mechanical support, while only the portions requiring direct living body contact use biocompatible materials. This localized application of biocompatibility preserves overall device strength while ensuring safety where needed.
Solution Approach 2:
The patent uses composite materials by combining high-strength insulating substrate materials with biocompatible materials in specific regions. This composite structure allows the device to simultaneously achieve high overall strength from the substrate and enhanced safety from the biocompatible portions, resolving the contradiction between strength and biocompatibility.
Data Source
AI summary
A resistor which is able to have a reduced thickness for an insulating substrate and in which occurrence of cracking is able to be suppressed during production of the insulating substrate, the production of the resistor and mounting of the substrate, and in which the safety of a medical device is increased by forming the insulating substrate using a biocompatible material; and a temperature sensor are provided. This resistor is provided with: an insulating substrate that has a bending strength of 690 MPa or more and a thickness of 10 to 100 μm; a resistive film that is formed on the insulating substrate; at least a pair of electrode layers, that are electrically connected to the resistive film; and a protective film that covers a region where the resistive film is formed, while forming exposure portions so that at least parts of the electrode layers are exposed therein.