Thin-Layer Separation Through Structure-Side Laser Irradiation
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Solution Overview
Problem
Existing methods for separating thin layers or structures from substrates using electromagnetic radiation are limited by the need for substrates that are transparent to the radiation, which restricts material selection and efficiency, particularly when using UV radiation for GaN layers on non-transparent materials like silicon.
Innovation Solution
Irradiate the boundary area between the structure and the substrate with electromagnetic radiation that penetrates through the structure rather than the substrate, allowing for efficient separation without energy loss and substrate damage, using shortwave radiation to promote plasma generation at the interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electromagnetic radiation is directed through the substrate to separate the thin layer, then the separation process can be performed, but the substrate must be transparent for the radiation wavelength used, which limits the choice of substrate materials
Solution Approach 1:
Instead of directing electromagnetic radiation through the substrate to reach the thin layer interface (prior art approach), the patent inverts the approach by directing radiation through the thin layer itself to reach the interface from the thin layer side. This allows use of opaque substrates like silicon while maintaining effective separation, as the radiation path no longer requires substrate transparency.
2Productivity
If an absorbing layer is provided between the substrate and the thin layer to enhance detachment, then the separation efficiency improves, but the process complexity and additional material requirements increase
Solution Approach 1:
The patent extracts and eliminates the additional absorbing layer from the system. By inverting the radiation direction to pass through the thin layer rather than the substrate, the thin layer itself serves as the absorbing medium, removing the need for separate absorbing layers and simplifying the overall process structure.
3Reliability
If high energy electromagnetic radiation is used to achieve effective separation, then the separation capability improves, but energy loss through the substrate reduces separation efficiency
Solution Approach 1:
The patent inverts the radiation path to minimize energy loss. Instead of radiation passing through the opaque substrate (causing absorption and energy loss), the radiation passes through the thin layer which is transparent or partially transparent at the selected wavelength, significantly reducing energy loss and improving separation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and defect-free separation of structures from substrates, particularly GaN layers, on non-transparent materials like silicon, allowing for cost-effective production and transfer to transparent substrates.
Implementation Method 1
electromagnetic radiation first penetrates the at least one structure and then strikes the boundary area
Implementation Method 2
The laser radiation is first passed from the rear side of the substrate through the substrate and then strikes the detachment layer or the thin layer. As a result of the interaction of the laser radiation with the absorbing layer, an ablation takes place
Data Source
AI summary
A method and a device for the separation of structures from a substrate. Furthermore, the invention relates to a method and a device for transferring structures from a first substrate to a second substrate.