Thin layered heating element for a fluid pump
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Solution Overview
Problem
Existing fluid pumps face challenges in achieving efficient heating with fast reaction times, compact design, and robustness while maintaining cost-effectiveness, due to issues with thick film resistors and substrate thermal expansion mismatch leading to cracks and energy inefficiencies.
Innovation Solution
A thin film heating element with a thickness of 10 µm or less, made via chemical or physical vapor deposition, is applied on a glass or ceramic substrate, with electrical contacts, and integrated into a fluid pump design to provide rapid heating rates and uniform heat distribution, using a substrate like quartz glass or ceramics, and electrical contacts made of conductive ink or paste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If thick film resistors are used as heating elements, then high specific loads are achieved, but manufacturing costs increase and reaction time is limited
Solution Approach 1:
The patent changes the thickness parameter of the heating element from conventional thick film (typically >10 μm) to thin film (≤10 μm), achieved through vapor deposition processes. This parameter change enables faster reaction times and lower manufacturing costs while maintaining high specific loads through optimized material composition and uniform thickness control
Solution Approach 2:
The patent replaces the conventional thick film resistor printing process with a vapor deposition process (physical or chemical), substituting a mechanical printing system with a vapor-phase deposition system. This substitution enables precise thickness control, uniform heating, and cost-effective manufacturing through automated deposition processes
2Loss of time
If thin layer heating element is used, then reaction time is improved and manufacturing cost is reduced, but substrate fragility and thermal expansion differences may cause cracks
Solution Approach 1:
The patent employs a composite structure consisting of a substrate (glass or ceramic), an insulating layer, a thin film heating element, and a protective outer layer. This composite design combines materials with complementary properties: the substrate provides mechanical support, the insulating layer provides electrical isolation, the thin film provides efficient heating, and the protective layer enhances durability and thermal shock resistance
Solution Approach 2:
The patent incorporates an insulating layer between the substrate and the thin film heating element, and potentially additional protective layers, to cushion and absorb thermal stresses before they can cause damage. This beforehand cushioning prevents cracks from forming due to thermal expansion differences between layers
3Loss of energy
If thin layer heating element is used, then heating efficiency is improved, but uniform layer thickness is difficult to achieve
Solution Approach 1:
The patent replaces mechanical printing or coating methods with vapor deposition processes (physical vapor deposition PVD or chemical vapor deposition CVD). These vapor-phase processes inherently provide uniform thickness distribution across the heating element surface through controlled vapor condensation or chemical reaction, eliminating the thickness variations typical of mechanical application methods
Solution Approach 2:
The patent optimizes deposition parameters including vapor deposition rate, substrate temperature, deposition time, and atmospheric conditions to achieve uniform thin film thickness. By precisely controlling these parameters, the process ensures consistent heating characteristics across the entire element surface while maintaining the thin profile necessary for high efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thin film technology enables heating rates up to 100°C per second and specific surface loads of 50 W/cm², ensuring efficient heating with minimal energy loss and improved durability, while maintaining a compact and cost-effective design.
Implementation Method 1
a thin layer of monocrystalline, polycrystalline or amorphous material provided on top of the substrate... electrical contacts provided in contact with the thin layer
Implementation Method 2
thin layered heating elements produced in particular via chemical vapour deposition (CVD)
Implementation Method 3
thin layered heating elements produced in particular via chemical vapour deposition (CVD) or PVD (physical vapour deposition)
Implementation Method 4
the heating element comprises a substrate, preferably made of glass, in particular quartz glass, or ceramics, a thin layer of monocrystalline, polycrystalline or amorphous material provided on top of the substrate
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3a~3c
AI summary
The present invention relates to a heating element and fluid pump including that heating element. The heating element (3) for a fluid pump (101, 110, 120, 130, 140, 150) comprises a substrate (31), preferably made of glass, in particular quartz glass, or ceramics, a thin layer (32) of monocrystalline, polycrystalline or amorphous material provided on top of the substrate (31), and electrical contacts (3a, 3b) provided in contact with the thin layer (32), preferably made of conductive ink or an electrically-conductive paste, wherein the thin layer (32) has a thickness equal to or smaller than 10 µm.