Thin LED Package Copper Traces for Heat Dissipation and Light Output
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Solution Overview
Problem
Conventional LED packages require thick copper traces for heat dissipation and structural integrity, leading to increased manufacturing costs, processing time, and reduced light output due to larger gaps, which are undesirable for efficient LED performance.
Innovation Solution
The use of thin metal components with conductive material thicknesses less than or equal to 10 microns, reducing thermal resistance and gap sizes, allowing for improved light output and manufacturing efficiency while maintaining performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thick Cu traces (50 μm or greater) are used, then heat dissipation and structural integrity are improved, but manufacturing cost and processing time increase
Solution Approach 1:
The patent changes the thickness parameter of Cu traces from conventional 50 μm or greater to thinner dimensions, achieving comparable heat dissipation performance while reducing material usage and manufacturing complexity. This parameter change resolves the contradiction by demonstrating that thinner traces can meet thermal requirements without incurring the higher costs and processing times associated with thicker traces.
2Temperature
If thick Cu traces (50 μm or greater) are used, then heat flow through ceramic is improved, but gap size increases reducing light output
Solution Approach 1:
The patent changes the Cu trace thickness parameter to thinner dimensions, which directly reduces the gap size between traces. This parameter change simultaneously improves light output by minimizing the gap through which light can escape while maintaining adequate heat flow through the ceramic substrate, thus resolving the contradiction between thermal performance and optical performance.
3Strength
If thick Cu traces are used, then structural integrity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent changes the Cu trace thickness parameter from thick to thin dimensions, which simplifies the manufacturing process by reducing the number of electroplating layers required and decreasing processing complexity. The thinner traces maintain sufficient structural integrity for the application while significantly reducing manufacturing complexity, thus resolving the contradiction between strength and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach results in LED packages with increased brightness, reduced manufacturing costs, and improved reliability by efficiently dissipating heat and minimizing light loss through smaller gaps, achieving comparable or superior performance to conventional thick-trace packages.
Implementation Method 1
thick Cu traces are necessary to spread heat and assist with heat flow through the ceramic and away from the LED
Data Source
AI summary
Light emitting diode (LED) packages and methods are disclosed herein. In one aspect, a light emitting package is disclosed. The light emitting package includes one or more areas of conductive material having a thickness of less than approximately 50 microns (μm). The package can further include at least one light emitting diode (LED) electrically connected to the conductive material and at least one thin gap disposed between areas of conductive material.