Semiconductor Package Layout for Thin LiFi Module Thermal Isolation
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Solution Overview
Problem
Conventional light transmission modules, such as LiFi modules, face challenges due to the large overall thickness resulting from the stacking of optical and electrical modules on different substrates, which does not meet market needs.
Innovation Solution
A semiconductor device package design where the optical device and electronic devices are positioned on opposite surfaces of a substrate with the optical device having a greater power than the electronic devices, and are laterally spaced apart to prevent overheating, with a case providing thermal dissipation and EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the optical module and electrical module are integrated on different substrates by stacking, then the design freedom and thermal interference are improved, but the overall thickness becomes too large
Solution Approach 1:
The patent merges the optical module and electrical module onto a single substrate, eliminating the need for stacking multiple substrates. This integration approach reduces the overall thickness while maintaining thermal management capabilities through strategic spatial separation of components on the same substrate plane.
Solution Approach 2:
The patent transitions from a vertical stacking arrangement (multiple layers in the thickness direction) to a planar arrangement (components distributed on the same substrate surface). This dimensional change from 3D stacking to 2D layout reduces the Z-axis thickness while managing thermal interference through lateral spacing and heat dissipation structures.
2Device complexity
If the optical device and electronic device are positioned close together on the substrate, then the device complexity is reduced, but the optical device overheats
Solution Approach 1:
The patent applies local quality by providing thermal management specifically for the optical device through dedicated heat dissipation structures positioned adjacent to the optical device. This localized approach addresses the overheating issue without requiring complete separation of components, maintaining overall device simplicity while ensuring thermal control where needed.
Solution Approach 2:
The patent introduces heat dissipation structures as intermediary elements between the optical device and electronic device. These structures act as thermal mediators that conduct heat away from the optical device, enabling close positioning of components while preventing overheating through the intermediary thermal management layer.
3Temperature
If the optical device and electronic device are laterally spaced apart, then the thermal management is improved, but the device complexity increases
Solution Approach 1:
The patent makes the substrate serve multiple functions: it provides mechanical support for both optical and electronic devices, enables lateral spacing for thermal management, and incorporates heat dissipation structures. This multi-functionality approach handles thermal management through the substrate's inherent capabilities rather than adding separate complex thermal control systems.
Data Source
AI summary
The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.