Thin Liquid Cooling Device for Portable Electronics

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Solution Overview

Problem

Conventional heat dissipation devices for portable electronic devices, such as fans with fins and radiating pipes, face challenges with noise, dust accumulation, and limited flexibility in handling multiple heat sources, leading to reduced efficiency and potential damage to electronic components.

Innovation Solution

A thin liquid-cooling heat dissipation device comprising a first and second casing with a thin pump and cooling member, where the pump and spacers are disposed on the same plane, allowing for flexible arrangement and improved heat dissipation without noise or dust issues, utilizing a compact design with fluid channels for efficient heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a fan with fins is used for heat dissipation, then heat dissipation function is provided, but rotation noise occurs and dust accumulates on fan blades reducing efficiency

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidrotation noise and dust accumulation

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the mechanical fan-based air cooling system with a liquid circulation system using a pump and cooling member. The pump circulates cooling liquid through channels in the cooling member that contacts heat-emitting components, eliminating rotating parts that generate noise and accumulate dust. This substitution resolves the contradiction by maintaining heat dissipation effectiveness while removing the harmful effects of fan rotation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If radiating pipe or cooling module with capillary structures is used, then heat dissipation is achieved, but design flexibility is limited and multiple heat emitting sources cannot be handled

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidflexibility for various heat emitting sources

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The cooling member is designed with multiple independent cooling channels that can be separately configured and routed to different heat-emitting sources within the portable electronic device. Each channel can be independently designed to match the thermal characteristics and position of specific components, providing modular flexibility. This segmentation allows the system to handle multiple heat sources with different thermal requirements while maintaining effective heat dissipation.

Inventive Principle:

Principle #1Segmentation

3Reliability

If conventional heat dissipation devices are used, then heat dissipation function is provided, but device thickness is large making it unsuitable for portable electronic devices

Engineering Contradiction:

Improveheat dissipation functionVSAvoiddevice thickness

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The cooling member is integrated within the housing structure of the portable electronic device, with cooling channels nested within the housing walls or positioned in close proximity to heat-emitting components. The pump and fluid reservoir are compactly arranged within the same housing space. This nested integration allows the heat dissipation system to function effectively while maintaining a thin overall device profile suitable for portable electronics.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides effective heat dissipation with reduced noise and dust, improved efficiency compared to air-cooling methods, and flexibility in accommodating various heat sources within portable electronic devices, enhancing the reliability and performance of these devices.

Implementation Method 1

the heat dissipation device is a liquid-cooling heat dissipation device

Methodology Applied

Scientific EffectLiquid cooling: Convection

Implementation Method 2

the cooling member disposed on the casing to contact the heat emitting source of the portable electronic device for heat dissipation

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS10145628B2Heat dissipation device and portable electronic device

Publication Date: 2018.12.04 DELTA ELECTRONICS INC(CN)

AI summary

A heat dissipation device includes a first casing, a second casing, a thin pump, and a cooling member. The second casing is connected to the first casing to form a first accommodating space and a second accommodating space adjacent to and communicating with the first accommodating space. The thin pump is disposed in the first accommodating space. The cooling member is disposed in the second accommodating space and has a plurality of spacers, and the spacers and the thin pump are disposed on the same plane of the first casing. A portable electronic device having the heat dissipation device is also disclosed.