Thin Metal Substrate with Thermal Conductive Adhesive
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Solution Overview
Problem
Conventional LED products face inefficiencies in heat dissipation due to thick thermal conductive adhesives, which increase product thickness and processing costs, and require high temperatures for thermoplastic polyimide processing, making them unsuitable for mass production.
Innovation Solution
A thin metal substrate with a copper foil layer, a thermal conductive adhesive layer containing resin and dispersed thermal conductive powder, and an insulating polymer layer, where the thermal conductive powder is 40-90% by weight and has an average particle diameter of 5-20 um, improving heat dissipation and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional thermal conductive adhesive with thickness of 60-120 um is used to meet insulating requirements, then insulating performance is improved, but overall product thickness increases and heat dissipating efficiency deteriorates
Solution Approach 1:
The patent reduces the thickness of the thermal conductive adhesive layer from the conventional 60-120 um to 1-10 um by changing the material composition parameters, specifically using a thermosetting resin with high dielectric strength and adding thermal conductive fillers to maintain insulating performance at reduced thickness
Solution Approach 2:
The patent creates a composite thermal conductive adhesive layer by combining thermosetting resin (epoxy, polyester, vinyl ester, or phenolic resin) with thermal conductive fillers (aluminum oxide, aluminum nitride, boron nitride, or silicon carbide), achieving both insulating and heat dissipation functions in a thin layer
2Length of stationary object
If TPI mixed with thermal conductive powder is used to reduce overall thickness, then product thickness is reduced and insulating characteristic is improved, but processing temperature must be greater than 350° C. which increases processing cost
Solution Approach 1:
The patent changes the processing temperature parameter from >350° C. (TPI process) to a lower temperature range by selecting thermosetting resins that cure at moderate temperatures, thereby reducing processing cost while maintaining thin layer thickness and insulating performance
Solution Approach 2:
The patent replaces expensive high-temperature TPI processing with more economical thermosetting resin-based processing that achieves the same functional results at lower temperature and reduced cost
3Temperature
If thermal conductive powder content is increased to 40-90% by weight in the adhesive layer, then heat dissipating efficiency is improved, but the adhesive layer becomes more brittle and harder to process
Solution Approach 1:
The patent optimizes the particle size parameter of thermal conductive powder to 5-20 um, which allows achieving high thermal conductivity at 40-90% weight content while minimizing the detrimental effect on adhesive strength and processability through appropriate particle size distribution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate achieves reduced thickness, enhanced heat dissipation efficiency, and improved anti-breakdown performance, with thermal conductivity exceeding 0.04 W/mK and increased breakdown voltage, while being suitable for mass production.
Implementation Method 1
a thermal conductive adhesive layer comprising a resin and a thermal conductive powder dispersed in the resin
Implementation Method 2
an insulating polymer layer disposed between the copper foil layer and the thermal conductive adhesive layer
Data Source
AI summary
A thin metal substrate having high thermal conductivity includes a copper foil layer, an insulating polymer layer and a thermal conductive adhesive layer. The thermal conductive adhesive layer has a resin and a thermal conductive powder dispersed in the resin. The insulating polymer layer is disposed between the copper foil layer and the thermal conductive adhesive layer. Since the thermal conductive adhesive layer has the thermal conductive powder and the insulating polymer layer has insulating and anti-breakdown abilities, the substrate has a reduced thickness, high heat dissipating efficiency and improved insulating performance.