Thin multi-channel heat exchanger
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Solution Overview
Problem
Traditional heat transfer methods are inefficient, leading to significant heat loss and increased costs due to the need for heavy materials, high pressure pumping, and bulkier systems, which also result in coolant leaks and reduced efficiency.
Innovation Solution
A thin heat exchanger that uses suction to transport coolant, reducing the need for pressurized systems and allowing for lighter, more flexible designs with a heat exchange layer constructed from high thermal conductivity materials and an envelope made from lower conductivity materials, such as rubber, with mesh material for enhanced efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional pressurized heat exchanger systems are used, then heat transfer efficiency can be maintained, but the system requires heavy materials, high pumping pressure, and bulkier construction
Solution Approach 1:
The patent inverts the traditional pressurized heat exchanger design by using suction (negative pressure) instead of pressurization to drive coolant flow. This allows the use of thin, lightweight materials for the heat exchange layer and envelope, eliminating the need for heavy pressure-containing structures while maintaining effective heat transfer through controlled suction flow
Solution Approach 2:
The patent employs a thin heat exchange layer and flexible envelope that can be drawn into various shapes. These thin-film structures are made possible by the suction-based design, which doesn't require the thick walls needed for pressurized systems, thereby reducing weight while preserving heat transfer functionality
2Strength
If traditional metal heat exchangers are used, then structural strength is sufficient, but heat loss to surrounding air increases and material cost increases
Solution Approach 1:
The patent uses a composite structure combining a thin heat exchange layer (metal or other material) with an envelope made from lower conductivity materials such as rubber or plastic. This composite design provides the necessary structural strength while the low-conductivity envelope material reduces heat loss to the surrounding air
3Productivity
If high pumping pressure is used to compensate for heat transfer inefficiency, then heat transfer rate increases, but system complexity and energy consumption increase
Solution Approach 1:
The patent replaces complex high-pressure pumping systems with a simpler suction-based flow control system. By using negative pressure and controlling flow rate through suction, the system achieves effective heat transfer without the complexity and energy consumption of high-pressure pumping infrastructure
4Stress or pressure
If traditional thick heat exchanger walls are used, then pressure containment is sufficient, but heat conduction distance increases reducing efficiency
Solution Approach 1:
The patent uses suction (negative pressure) instead of positive pressure, allowing the heat exchanger to use thin walls that provide adequate containment for negative pressure while minimizing heat conduction distance. This resolves the contradiction between pressure containment requirements and heat transfer efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thin heat exchanger achieves greater heat collection efficiency with reduced heat loss, lower material costs, and the ability to conform to non-flat surfaces, while minimizing leaks and energy consumption.
Implementation Method 1
a heat conduction layer provided over the envelope
Implementation Method 2
the thin heat exchanger uses suction, rather than pressurization to transport coolant
Data Source
AI summary
Technologies are disclosed herein for a thin heat exchanger through which coolant may be pumped. The heat exchanger may include an envelope and a heat conduction layer provided over the envelope. The envelope may include one or more channels formed therein. The channels formed between the envelope and the conduction layer may extend the length of the heat exchange layer and be configured to carry coolant therethrough. The heat exchange layer may include an inlet manifold on a first end and an outlet manifold on another end opposing the first end. The inlet manifold may allow the flow of coolant into the heat exchange layer and the outlet manifold may allow the removal of the coolant from the heat exchange layer. Coolant flow may be controlled by a suction pump operating under computer control based at least in part on sensor data.


