Integrated Circuit Protection Layout for Thin Noise and ESD Control
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Solution Overview
Problem
Circuit protection devices for portable electronic devices face challenges in reducing thickness while maintaining reliability due to the need for separate components like common mode noise filters and ESD protection devices, which increase the device's thickness and area requirements.
Innovation Solution
A circuit protection device is designed with a nonmagnetic layer between magnetic layers, where the noise filter part is disposed on the nonmagnetic layer and the ESD protection part is disposed on the magnetic layer, using a porous insulation material with a ferroelectric ceramic and conductive layers with porous oxide surfaces to reduce thickness and improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a common mode noise filter and ESD protection device are separately mounted or laminated in one chip, then noise suppression and ESD protection functions are achieved, but the device thickness increases
Solution Approach 1:
The patent combines the common mode noise filter and ESD protection device into a single integrated structure where the ESD protection device is formed within the same chip as the common mode noise filter. The ESD protection device uses internal electrodes and ESD protection members disposed between them, while the common mode noise filter uses coil patterns on nonmagnetic sheets, both integrated in one chip to reduce overall device thickness while maintaining both functions
Solution Approach 2:
The patent transitions from a multi-layer magnetic sheet structure to a planar integration approach where both the common mode noise filter and ESD protection device are formed on the same chip plane. The ESD protection device is constructed using internal electrodes and ESD protection members within the chip body, eliminating the need for separate stacked magnetic layers and reducing thickness in the vertical dimension
2Reliability
If multiple magnetic and nonmagnetic layers are laminated to form the circuit protection device, then functional separation is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the common mode noise filter and ESD protection device into a single chip structure, eliminating the need for separate magnetic and nonmagnetic layer laminations. Both functions are integrated on the same chip using planar coil patterns for the noise filter and internal electrodes with ESD protection members for the ESD device, significantly reducing structural complexity
Solution Approach 2:
The chip structure serves multiple functions simultaneously: it provides both common mode noise filtering through coil patterns and ESD protection through internal electrodes and ESD protection members. This multi-functional integration eliminates the need for separate dedicated components and simplifies the overall device architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a thinner circuit protection device that can be mounted in smaller spaces, improving reliability by eliminating the need for a glassy surface layer and enhancing moisture resistance.
Implementation Method 1
each of the first and second internal electrodes is formed as a conductive layer wherein a porous oxide is formed on a surface thereof as a porous insulation layer
Implementation Method 2
the electrostatic discharge protection member is formed of a porous insulation material, the porous insulation material is formed of ferroelectric ceramic having a dielectric constant of about 50 to about 50,000
Data Source
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Figure 5
AI summary
The present disclosure discloses a circuit protection device including a first magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, a second magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, and a nonmagnetic layer in which a plurality of nonmagnetic sheets are laminated and which is disposed between the first and second magnetic layers. A noise filter part including a plurality of coil patterns is disposed in the nonmagnetic layer.