Thin OLED Fabrication with UV Blocking and Friction Layers
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Solution Overview
Problem
The challenge lies in fabricating thin organic light-emitting diodes (OLEDs) for slim devices like mobile phones and personal digital assistants, where existing methods face issues with high production costs, low production yield, and substrate damage due to the complexity and time-consuming processes involved in achieving a thickness of less than 1 mm, while also requiring protection from UV rays during fabrication.
Innovation Solution
A method involving the use of substrates with a thickness between 0.05 and 1 mm, where a non-transmissive layer is formed to prevent UV exposure and a friction-preventing layer is applied to prevent substrate damage, along with a buffer layer to protect against moisture and gases, and a flowchart outlining the steps for forming the OLED, including substrate preparation, attachment, semiconductor layer formation, and separation to reduce fabrication time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the substrate thickness is reduced to less than 1 mm to achieve thin OLEDs, then the device thickness is improved, but the substrate becomes prone to bending and damage during fabrication
Solution Approach 1:
A friction-preventing layer is applied to the substrate surface before device layer formation. This preliminary protective measure prevents substrate bending and damage during subsequent fabrication processes, enabling the use of thin substrates (less than 1 mm) without compromising structural integrity during manufacturing
Solution Approach 2:
The friction-preventing layer acts as a cushioning layer that reduces friction between the substrate and fabrication apparatuses. This beforehand cushioning prevents direct contact damage and bending forces on the thin substrate, allowing thin OLED fabrication while maintaining substrate strength during the manufacturing process
2Length of moving object
If traditional fabrication methods are used to achieve thin OLEDs, then the device thickness is reduced, but production time increases due to complex processes
Solution Approach 1:
The friction-preventing layer is applied in advance to the substrate, enabling subsequent fabrication steps to proceed without additional protective measures. This preliminary action streamlines the process by eliminating the need for complex intermediate protection steps, reducing overall fabrication time while maintaining thin OLED dimensions
Solution Approach 2:
The invention changes the surface friction parameter of the substrate by applying a friction-preventing layer. This parameter change enables smoother processing during fabrication, reducing mechanical resistance and allowing faster, simpler manufacturing steps that reduce overall production time for thin OLEDs
3Length of moving object
If traditional fabrication methods are used to achieve thin OLEDs, then the device thickness is reduced, but production costs increase due to low yield
Solution Approach 1:
The friction-preventing layer is applied beforehand to prevent substrate damage during fabrication. This preliminary protective measure significantly reduces substrate breakage and device layer damage, improving production yield. Higher yield directly reduces production costs per unit, making thin OLED manufacturing more economically viable
Solution Approach 2:
The friction-preventing layer serves as a disposable protective element that is applied to the substrate and then removed or remains as part of the final structure. This simple, easily applied layer provides substantial protection against expensive substrate damage, reducing the cost of failed devices and improving overall production efficiency for thin OLEDs
4Length of moving object
If the substrate is made thin to achieve slim devices, then device thickness is improved, but UV ray protection becomes insufficient
Solution Approach 1:
A non-transmissive layer is introduced as an intermediary between the substrate and the organic light emitting diode. This layer blocks UV rays from reaching and damaging the OLED components, providing necessary protection in thin device configurations where the substrate itself cannot provide sufficient UV shielding
Solution Approach 2:
The invention uses a composite structure combining the substrate, friction-preventing layer, non-transmissive layer, and device layers. The non-transmissive layer in this composite structure specifically addresses UV protection, while the friction-preventing layer addresses mechanical protection, creating a multi-functional protective system for thin OLEDs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a cost-effective and efficient method for producing thin OLEDs with reduced production time, improved yield, and protection from UV exposure, enabling their use in modern slim devices without substrate damage, while maintaining the necessary thinness and functionality.
Implementation Method 1
where UV-rays can not be transmitted to an organic light emitting diode via a substrate during fabrication or after fabrication
Implementation Method 2
a friction-preventing layer is applied to prevent substrate damage
Implementation Method 3
a buffer layer to protect against moisture and gases
Data Source
Figure 1~2
Figure 3~4a
Figure 4b~4e
AI summary
A thin organic light emitting device (100) that can be used in thin devices like mobile phones and personal digital assistants. An organic light emitting display (OLED) includes a layer (160) that blocks UV rays so that the diode (200) and the transistor are shielded from UV rays during and after production. In order to prevent breakage during production, two substrates are bonded together and the devices are formed on each of the two substrates, providing a thicker structure that is less apt to break. The substrates are separated after production is complete.