Integrated EMI Shielding Structure for Thin Semiconductor Packages
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Solution Overview
Problem
Existing semiconductor packages face challenges with electromagnetic interference (EMI) shielding, including increased package thickness, warpage, and delamination, especially when embedding a metal shielding layer, and surface coating methods are not suitable for mass production.
Innovation Solution
The semiconductor package structure integrates a conductive shielding layer that is electrically connected to patterned conductive layers on the package substrate, providing EMI shielding while avoiding the complexities and thickness issues associated with traditional methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal shielding layer is embedded in the encapsulant of the semiconductor package, then EMI shielding is provided, but package thickness is increased and package warpage may occur
Solution Approach 1:
The EMI shielding layer is merged with the existing patterned conductive layers on the package substrate to form an integrated conductive structure. This integration eliminates the need for a separate embedded shielding layer, thereby maintaining package thickness while providing effective EMI shielding through the combined conductive network.
Solution Approach 2:
The patterned conductive layers on the package substrate are designed to serve multiple functions: electrical connection for semiconductor devices and EMI shielding. By making these conductive layers multi-functional, the patent provides EMI protection without adding extra layers that would increase package thickness.
2Object-affected harmful factors
If a metal shielding layer is embedded in the encapsulant of the semiconductor package, then EMI shielding is provided, but the shielding layer may become delaminated
Solution Approach 1:
The EMI shielding function is merged with the patterned conductive layers that are already adhered to the package substrate through existing fabrication processes. This integration ensures reliable adhesion since the conductive layers are formed as part of the substrate structure rather than being separately embedded, eliminating delamination risks.
3Object-affected harmful factors
If metal is coated on the surface of the encapsulant after singulation, then EMI shielding is provided, but the package structure is not suitable for mass production
Solution Approach 1:
The EMI shielding conductive layers are formed on the package substrate before the singulation process. This preliminary formation allows the shielding structure to be created using standard fabrication processes suitable for mass production, rather than requiring post-singulation coating operations that would reduce productivity.
Solution Approach 2:
The EMI shielding structure is merged into the pre-singulation fabrication process flow, combining multiple functions (electrical connection and EMI shielding) into a single integrated structure that can be manufactured efficiently in mass production environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces EMI, prevents package warpage and delamination, and simplifies the manufacturing process, enhancing the reliability, yield, and cost-effectiveness of semiconductor packages.
Implementation Method 1
a conductive shielding layer covering and surrounding the encapsulating layer and electrically connected to the plurality of exposed conductors
Data Source
Figure 1~2A
Figure 2B~2C
Figure 3
AI summary
A semiconductor package structure including an encapsulating layer, a package substrate, and a conductive shielding layer is provided. The package substrate has a device region covered by the encapsulating layer and an edge region surrounding the device region and exposed from the encapsulating layer. The package substrate includes an insulating layer and a patterned conductive layer in a level of the insulating layer. The patterned conductive layer includes conductors in and along the edge region. The edge region is partially exposed from the conductors, as viewed from a top-view perspective. The conductive shielding layer covers and surrounds the encapsulating layer and is electrically connected to the conductors.