Thin Substrate Package Layout for Handling-Flimsy Laminate Strips
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Solution Overview
Problem
The challenge in semiconductor packaging lies in handling thin substrates, which become flimsy and difficult to manage due to their fragility, especially when trying to assemble large strips like those measuring 240 x 74 millimeters, leading to issues in fabricating smaller, faster, and higher-performing semiconductor packages.
Innovation Solution
The integration of lead frame portions as stiffeners or supports within the package to stabilize the thin organic laminate substrates, allowing for more efficient handling and assembly by positioning the substrate between lead frame portions and encapsulating it with a molding compound, thereby enhancing stability and reducing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If substrate thickness is reduced to achieve miniaturization, then package size decreases, but handling difficulty increases due to flimsiness
Solution Approach 1:
The patent introduces lead frame portions as intermediary support structures between the thin substrate and the handling system. These lead frame portions act as mediators that provide mechanical support to the flimsy thin substrate during handling and assembly operations, enabling easy manipulation without increasing the final package size.
Solution Approach 2:
The patent divides the support function into separate lead frame portions that can be independently positioned and attached to the thin substrate. This segmentation allows the support structure to be optimized for handling while keeping the substrate itself thin and compact for the final package.
2Weight of moving object
If substrate thickness is reduced for miniaturization, then package weight decreases, but structural stability deteriorates
Solution Approach 1:
The patent creates a composite structure combining the thin substrate with lead frame portions. This composite construction maintains the low weight benefit of the thin substrate while incorporating the high strength-to-weight ratio of the lead frame material to provide the necessary structural stability for the final package.
Solution Approach 2:
The patent embeds the thin substrate within the structure formed by the lead frame portions. The lead frame portions are positioned around and support the substrate, creating a nested configuration where the lightweight substrate is protected and stabilized by the stronger lead frame structure.
3Reliability
If lead frame portions are used as stiffeners, then handling stability improves, but device complexity increases
Solution Approach 1:
The lead frame portions serve multiple functions simultaneously: they provide structural support for handling, act as electrical interconnects, and form part of the final package structure. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while achieving handling stability.
Solution Approach 2:
The patent merges the support/stiffener function with the existing lead frame interconnect structure. Instead of adding separate stiffening elements, the lead frame portions are designed to fulfill both mechanical support and electrical connection roles, thereby improving handling stability without proportionally increasing structural complexity.
Data Source
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AI summary
The present disclosure is directed to a thin substrate package and a lead frame method of fabricating the semiconductor package (100). The semiconductor package includes a first lead frame portion (109) and a second lead frame portion (104). A substrate (102) is positioned in a center opening (118) between the first lead frame portion and the second lead frame portion, the substrate having a thickness less than or equal to 0.10-millimeters (mm). A first die (110) having a plurality of wires is positioned on the substrate by an adhesive (108). A molding compound (116) covers the first and second lead frame portions, the substrate, and the first die.