Thin Package Stiffener Fabrication via Carrier Patterning
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Solution Overview
Problem
Thin substrates for electronic component packages are prone to bending, leading to potential failure due to increased flexibility, which compromises the reliability and durability of the package.
Innovation Solution
A method is developed to form a stiffener within the package by patterning a second carrier into a stiffener without using adhesives, integrating it into the package structure, which includes forming a circuit pattern on a first carrier, embedding it in a dielectric material on a second carrier, removing the first carrier, and filling laser-ablated artifacts in the dielectric material with conductive material to create a buildup circuit pattern, while the stiffener provides rigidity to the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the substrate is made thin to facilitate formation of a thin electronic component package, then the package thickness is reduced, but the substrate flexibility increases causing bending and potential failure
Solution Approach 1:
The substrate system is segmented into multiple functional layers: a thin flexible circuit pattern layer on a first carrier, and a stiffener structure formed from a second carrier. This segmentation allows the thin substrate to maintain flexibility for electrical connections while the separate stiffener layer provides mechanical support to prevent bending and failure.
Solution Approach 2:
The patent employs composite material structures by combining the circuit pattern with dielectric material and the stiffener formed from the second carrier. This composite construction integrates the flexible electrical circuiting with the rigid mechanical support in a single integrated structure, eliminating the need for adhesive bonding while achieving both thinness and reliability.
2Strength
If a stiffener is added to prevent bending, then the package rigidity increases, but the package thickness increases
Solution Approach 1:
The stiffener structure is merged with the circuit pattern assembly by forming the stiffener from the second carrier that originally supported the dielectric material. This integration allows the stiffener to become part of the substrate structure itself rather than an add-on component, providing rigidity without significantly increasing overall package thickness.
Solution Approach 2:
The patent changes the physical state and configuration of the second carrier by patterning it into a stiffener structure. Through laser ablation and selective removal of material, the second carrier is transformed from a flat support layer into a three-dimensional stiffener with enhanced mechanical properties, providing rigidity while maintaining thin overall dimensions.
3Ease of manufacture
If adhesive is used to mount the stiffener, then the stiffener can be attached, but the manufacturing process complexity increases
Solution Approach 1:
The second carrier serves a dual function: it initially supports the dielectric material during manufacturing, and then is patterned into the stiffener structure itself. This self-service approach eliminates the need for separate adhesive mounting steps, as the stiffener is inherently integrated into the substrate structure through the carrier transformation process.
Solution Approach 2:
The adhesive mounting step is extracted and eliminated from the manufacturing process. Instead of attaching the stiffener separately with adhesive, the stiffener is formed in-situ by patterning the second carrier, removing the need for additional bonding materials and simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a thin, rigid package that maintains flatness and minimizes flexibility, ensuring the structural integrity and reliability of the electronic component package.
Implementation Method 1
Laser-ablated artifacts are formed in the buildup dielectric material
Data Source
AI summary
A method of forming a package includes forming a circuit pattern on a first carrier and embedding the circuit pattern in a dielectric material on a second carrier. The first carrier is removed and a buildup dielectric material is mounted to the dielectric material and the circuit pattern. Laser-ablated artifacts are formed in the buildup dielectric material and filled with an electrically conductive material to form a buildup circuit pattern. The second carrier is patterned into a stiffener, which provides rigidity to the thin package.