Thin-Plate Loop Heat Pipe Isolates Heat Leakage
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Solution Overview
Problem
Existing loop heat pipes are too thick and complex in structure, leading to heat leakage issues that reduce their heat transfer efficiency, making them unsuitable for high heat flux electronic devices with ultra-thin and compact structures.
Innovation Solution
A thin-plate loop heat pipe design where two housing plates are sealed together to form a compact structure with integrated components, including a second vapor chamber and an auxiliary fluid channel, which isolates heat leakage and reduces the heat transfer temperature difference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat pipes are used, then heat dissipation is provided, but the thickness is large and heat transfer capacity is insufficient for ultra-thin electronic devices
Solution Approach 1:
The heat pipe is segmented into distinct functional zones: an evaporator section with capillary wick structure for intense heat absorption, a vapor transport channel, a condenser section for heat release, and a liquid return channel. This segmentation allows each section to be optimized for its specific function, enabling high heat transfer capacity in a thin profile by concentrating heat transfer activities in specific regions rather than requiring uniform thickness throughout
Solution Approach 2:
The capillary wick structure is nested within the evaporator chamber, and the liquid return channel is integrated within the housing structure. The condenser section contains flow channels that are embedded within the housing plates. This nesting approach allows multiple functional elements to occupy overlapping spatial volumes, reducing the overall thickness while maintaining all necessary heat transfer pathways
2Ease of manufacture
If loop heat pipe components are separated and connected by welding, then assembly is possible, but the manufacturing process becomes complex and thickness increases
Solution Approach 1:
The housing is designed as an integrated structure where the evaporator chamber, condenser chamber, vapor channel, and liquid channel are formed as unified components within a single housing assembly. The first and second housing plates are sealed together to enclose these chambers and channels, eliminating the need for separate welded connections between multiple discrete components. This merging reduces manufacturing complexity and enables thinner overall construction
Solution Approach 2:
The housing structure serves multiple functions simultaneously: it provides the evaporator chamber, condenser chamber, vapor and liquid channels, and structural support. The first and second housing plates not only enclose the system but also form the heat transfer surfaces and contain the working fluid pathways. This multi-functionality reduces the number of separate components needed, simplifying manufacturing while maintaining assembly capability
3Productivity
If evaporator pressure and temperature are higher than compensator, then heat transfer drives the cycle, but heat leakage occurs from evaporator to compensator reducing efficiency
Solution Approach 1:
The harmful heat leakage pathway is extracted and isolated by introducing a second vapor chamber positioned between the first vapor chamber and the compensator. Heat leakage that would otherwise directly reach the compensator is redirected through this intermediate chamber, where it can be managed separately. This extraction of the leakage path allows for targeted management of the heat flow without disrupting the main heat transfer cycle
Solution Approach 2:
The second vapor chamber acts as an intermediary element between the high-pressure evaporator and the low-pressure compensator. This intermediate chamber provides a buffer zone that manages the pressure and temperature transition, reducing direct thermal coupling between the evaporator and compensator. The intermediary structure allows heat leakage to be managed through controlled phase change and pressure equalization rather than direct conduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thin-plate loop heat pipe achieves efficient heat dissipation with reduced thickness and complexity, effectively addressing heat leakage issues and maintaining high heat transfer performance for high heat flux electronic devices.
Implementation Method 1
the liquid-phase working medium vaporizes on the surface of the capillary wick inside the evaporator
Implementation Method 2
the liquid-phase working medium vaporizes on the surface of the capillary wick inside the evaporator
Implementation Method 3
the vaporized working medium enters the condenser along the vapor line and exothermically condenses into liquid-phase working medium in the condenser
Implementation Method 4
The liquid-phase working medium then flows to the compensator along the liquid line
Data Source
AI summary
A thin-plate loop heat pipe comprises a housing including a first housing plate and a second housing plate that are relatively covered and sealed together at edges. An evaporation chamber, a vapor channel, a condensation chamber, a liquid channel, a compensation chamber and an auxiliary fluid channel are formed between the first housing plate and the second housing plate. The compensation chamber stores a liquid-phase working medium. A first capillary structure divides the evaporation chamber into a first vapor chamber and a second vapor chamber. The second vapor chamber is located between the first vapor chamber and the compensation chamber, the second vapor chamber is separated from the compensation chamber by the first capillary structure, the first vapor chamber and the condensation chamber communicate with each other by the vapor channel, the second vapor chamber and the condensation chamber communicate with each other by the auxiliary fluid channel.