Redistribution Semiconductor Package for Thin Low-Cost Power Dies
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Solution Overview
Problem
Existing semiconductor package structures made by flip die technology are not thin enough and have high manufacturing costs, particularly for power components with a small number of contacts.
Innovation Solution
The use of a wire bonding process instead of a ball mounting process, combined with a redistribution process, to reduce the overall thickness of the semiconductor package to less than 0.15 mm and lower manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If flip die technology is used to manufacture semiconductor packages, then the manufacturing cost is high, but the package thickness is reduced
Solution Approach 1:
The patent inverts the conventional ball mounting process by using wire bonding to form conductive bumps directly on bonding pads. Instead of mounting pre-formed balls, the invention bonds wires and forms bumps in-place, achieving both cost reduction and thickness reduction simultaneously for power components with small contact numbers
2Ease of manufacture
If ball mounting process is used, then the manufacturing cost is reduced, but the package thickness increases
Solution Approach 1:
The patent extracts the ball mounting step from the conventional process and replaces it with wire bonding and bump formation. By removing the ball mounting process entirely and using wire bonding instead, the invention achieves both lower manufacturing cost and reduced package thickness for power components
3Ease of manufacture
If conventional packaging process is used, then the manufacturing cost is high, but the package thickness is not reduced enough
Solution Approach 1:
The patent changes the fundamental process parameters by replacing ball mounting with wire bonding and implementing a redistribution layer structure. This parameter change enables simultaneous achievement of lower manufacturing cost and reduced package thickness below 0.15mm for power components with small contact numbers
Data Source
AI summary
The present disclosure provides a semiconductor package. The semiconductor package includes a first die, a plurality of first bonding pads, a plurality of first conductive bumps, a molding layer and a redistribution layer. The first die has a top surface and a bottom surface opposing to the top surface. The first bonding pads are disposed on the top surface of the first die. The first conductive bumps are disposed on the first bonding pads, and the first conductive bumps are electrically connected with the first die. The molding layer covers the top surface of the first die and exposes the first conductive bumps. The redistribution layer is disposed on the molding layer to electrically connect to the first conductive bumps. The present disclosure further provides a method of manufacturing the above semiconductor package.