Thin Resistor Structure With Embedded Electrodes for TCR Control
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Solution Overview
Problem
Existing resistors face challenges in reducing size and controlling temperature coefficient of resistance (TCR) due to thickness and spacing limitations of internal electrodes, leading to increased size and heat accumulation.
Innovation Solution
A thin resistor design with partially embedded internal electrodes in a resistive layer, allowing for reduced overall thickness and improved TCR control, with smoother current flow and enhanced heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of the resistive layer is increased to reduce the resistance value, then the resistance value is reduced, but the overall size of the resistor increases
Solution Approach 1:
The patent transitions from a conventional planar electrode arrangement to a three-dimensional partially embedded structure, where internal electrodes are positioned both on the surface and within the resistive layer. This dimensional change allows for reduced resistance without increasing the overall footprint of the resistor, as the embedded portion utilizes the vertical dimension to create additional conductive pathways.
2Quantity of substance
If the spacing between the pair of internal electrodes is reduced to reduce the resistance value, then the resistance value is reduced, but the control of temperature coefficient of resistance (TCR) deteriorates
Solution Approach 1:
The patent applies different structural qualities to different regions of the electrode system. The internal electrodes have a partially embedded configuration with specific spacing, while the external electrodes maintain conventional spacing. This local differentiation allows the internal electrodes to provide low resistance through their embedded portion, while the external electrodes and their spacing preserve TCR control capabilities.
3Manufacturing precision
If the thickness of the pair of internal electrodes is increased to reduce TCR, then TCR is reduced, but the overall size of the resistor increases
Solution Approach 1:
Instead of increasing electrode thickness in a single dimension, the patent utilizes the vertical dimension by embedding portions of the internal electrodes within the resistive layer. This partial embedding achieves TCR reduction through the embedded configuration rather than through increased thickness, thereby avoiding an increase in overall resistor size.
4Ease of manufacture
If the internal electrodes do not embed in the resistive layer, then the manufacturing process is simpler, but heat accumulation increases and heat conduction capability decreases
Solution Approach 1:
The patent incorporates the embedding of internal electrodes within the resistive layer during the initial manufacturing process, rather than as a subsequent modification. This preliminary action integrates the heat dissipation function into the base structure, allowing current to flow more smoothly between the resistive layer and electrodes, thereby reducing heat accumulation without requiring additional manufacturing steps.
Data Source
AI summary
A thin resistor includes an insulating layer, a resistive layer, a pair of internal electrodes, a protective layer, and a pair of external electrodes. The resistive layer is disposed on the insulating layer, in which the resistive layer includes a pair of recesses, and the pair of recesses is located on two opposite ends of the resistive layer, respectively. The pair of internal electrodes is respectively disposed in the pair of recesses and on the resistive layer, and top surfaces of the pair of internal electrodes are higher than a top surface of the resistive layer. The protective layer covers a portion of the resistive layer and portions of the internal electrodes. The pair of external electrodes is electrically connected to the pair of internal electrodes.