Thin-Section Centrifugal Pump for Electronics Cooling
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Solution Overview
Problem
Existing electronics cooling systems, particularly in high-density RF and other electronics, face challenges in effectively minimizing junction temperatures and ensuring system reliability due to limitations in thermal transfer capabilities of traditional cooling methods like forced-air cooling, which are inadequate for high thermal loads.
Innovation Solution
A scalable, thin-section centrifugal pump with a brushless open-frame motor and magnetic coupling is integrated into electronic structures to provide high flow rates and pressure heads, utilizing a closed-loop coolant system for efficient thermal energy transfer, avoiding large plumbing systems and incorporating additive manufacturing for adaptability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional forced-air cooling or large-diameter torque motor pumps are used, then cooling capability is sufficient for high thermal loads, but the system size and structural thickness increase significantly
Solution Approach 1:
The pump is divided into functionally independent segments: a thin-section impeller wheel with vanes for fluid propulsion, a separate hub for motor coupling, and a circular housing that contains the brushless motor. This segmentation allows each component to be optimized independently, enabling the impeller to achieve high flow rates in a thin profile without requiring a large-diameter motor
Solution Approach 2:
The design transitions from a conventional thick pump structure to a thin-section configuration by redistributing functional elements across different dimensions. The impeller wheel operates efficiently in a thin axial dimension while the circular housing provides the necessary radial space for motor components, effectively moving the problem from a one-dimensional thickness constraint to a two-dimensional area solution
2Length of moving object
If miniature brushless motor pumps are used, then the pump size is reduced for integration, but the volume flow rate and pressure capability decrease
Solution Approach 1:
The impeller wheel features locally optimized vane geometry with specific curvature and spacing designed to maximize fluid acceleration in the thin-section configuration. The vanes are shaped to create efficient fluid dynamics patterns that generate high flow rates despite the reduced overall pump size, compensating for the smaller motor dimensions
Solution Approach 2:
The hub is nested within the circular housing, and the impeller wheel is nested within the housing structure, creating a compact integrated assembly. This nesting arrangement allows the pump to maintain a small overall footprint while still accommodating the necessary motor and impeller components for high flow rate operation
3Ease of manufacture
If dry contact clamping methods are used for thermal conduction, then mechanical assembly is simplified, but thermal transfer performance is compromised
Solution Approach 1:
The design replaces mechanical dry contact clamping with a fluid-based thermal conduction system. The thin-section pump housing serves as a fluid conduit that directly contacts or closely approaches the heat-generating electronic components, using flowing coolant instead of mechanical pressure to achieve superior thermal transfer efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively lowers junction component temperatures, increases packaging densities, and enhances system performance by providing high-pressure, low-noise, and vibration-reduced cooling, suitable for high-density electronic components.
Implementation Method 1
a centrifugal impeller. The pump is configured to transport a fluid to transfer thermal energy
Implementation Method 2
a brushless open frame motor
Implementation Method 3
transport coolant in a closed loop to transfer thermal energy away from the one or more electronic components
Data Source
AI summary
A pump includes a circular housing having a thin profile, a brushless open frame motor, and a centrifugal impeller. The pump is configured to transport a fluid to transfer thermal energy to or from one or more external components.