Thin Section Preparation Device Using Epi and Diffusion Imaging

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Solution Overview

Problem

In thin section fabrication, achieving a desired exposure state of biological samples during preliminary cutting is challenging due to reliance on operator intuition, leading to inefficiencies and increased workload, as the imaging data from epi-illumination and diffusion illumination are overlapped but require manual adjustment.

Innovation Solution

A thin section fabrication apparatus that automatically determines the desired exposure state by comparing the exposed shape and embedded shape of the biological sample using epi-image and diffuse image data, controlling the cutting process to ensure the sample is securely and accurately exposed, with features like area ratio calculation and vector analysis to adjust the cutting blade and block position.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If manual observation and adjustment are used during preliminary cutting, then the operator can visually confirm the exposed surface, but the process requires dozens of repeated adjustments and places a large burden on the operator

Engineering Contradiction:
Improvevisual confirmation of exposed surfaceVSAvoidcutting efficiency
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The patent replaces manual mechanical observation and adjustment with an automated imaging and control system. The imaging unit captures images of the embedding block surface, and the control unit automatically processes these images to determine cutting amounts and angles, substituting the operator's mechanical adjustment process with automated optical and computational systems.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system enables self-service by allowing the embedding block to be automatically analyzed and processed without continuous operator intervention. The control unit uses the captured images to automatically determine cutting parameters and control the cutting unit, making the system self-regulating and reducing dependency on operator skill and attention.

Inventive Principle:
Principle #25Self-service

2Manufacturing precision

If the operator continuously observes and adjusts cutting parameters manually, then the desired exposure state can be achieved, but the process cannot be restarted and requires long periods of skill and attentiveness

Engineering Contradiction:
Improvedesired exposure stateVSAvoidoperator skill requirement
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent implements feedback by using the imaging unit to continuously capture images of the embedding block surface during cutting. The control unit processes these images to monitor the exposed surface state and automatically adjusts cutting parameters based on this feedback, creating a closed-loop control system that ensures precise achievement of the desired exposure state.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system performs preliminary action by capturing images and analyzing the embedding block surface before making cutting adjustments. The control unit determines the appropriate cutting amount and angle based on image analysis before executing the cut, allowing for planned and precise adjustments rather than reactive trial-and-error approaches.

Inventive Principle:
Principle #10Preliminary action

3Loss of information

If epi-illumination and diffusion illumination are used together, then imaging data can be acquired for analysis, but manual adjustment of cutting parameters based on overlapped images remains required

Engineering Contradiction:
Improveimaging data acquisitionVSAvoidmanual adjustment burden
Core Design Contradiction:
Loss of informationVSEase of operation

Solution Approach 1:

The patent replaces manual adjustment operations with automated control based on image processing. The control unit automatically analyzes the overlapped imaging data from epi-illumination and diffusion illumination sources and translates this information into automated cutting parameter adjustments, eliminating the need for manual interpretation and adjustment by the operator.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system achieves self-service by automatically processing the imaging data and controlling the cutting parameters without operator intervention. The control unit uses the combined information from both illumination methods to autonomously determine and execute the appropriate cutting adjustments, making the system self-sufficient.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for automatic and secure attainment of the desired exposure state, reducing operator burden and improving cutting efficiency by eliminating the need for manual adjustments and intuition-based decisions during preliminary cutting.

Implementation Method 1

When the epi-illumination light is radiated to the embedding block, a luminance difference is generated between a portion of an embedding agent such as the paraffin and the exposed portion of the biological sample.

Methodology Applied
Scientific EffectLight reflection and scattering: Reflection

Implementation Method 2

when the diffusion illumination light is radiated to the embedding block, the light enters the inner portion of the embedding block, abuts the biological sample which is not exposed to a cutting surface, and is reflected.

Methodology Applied
Scientific EffectLight diffusion and reflection: Diffusion

Data Source

PatentEP2813833B1Thin section preparation device and thin section preparation method
Publication Date: 2018.04.11 SAKURA FINETEK JAPAN
  • EP2813833B1 patent drawingFigure 1
  • EP2813833B1 patent drawingFigure 2A~2B
  • EP2813833B1 patent drawingFigure 3

AI summary

A thin section fabrication apparatus includes an epi-imaging data acquisition unit that performs imaging by radiating epi-illumination and acquires imaging data, a diffusion imaging data acquisition unit that performs imaging by radiating diffusion illumination and acquires imaging data, an exposed shape extraction unit that extracts an exposed shape of an exposure portion of the biological sample which is exposed to a surface of the embedding block, based on the imaging data acquired by the epi-imaging data acquisition unit, an embedded shape extraction unit that extracts an embedded shape of an embedding portion of the biological sample which is embedded in the embedding block, based on the imaging data acquired by the diffusion imaging data acquisition unit, and a control unit that determines ending of the preliminary cutting by comparing the exposed shape extracted by the exposed shape extraction unit and the embedded shape extracted by the embedded shape extraction unit.